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STP40N05FI

STMicroelectronics

STP40N05FI by STMicroelectronics

STP40N05FI by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 50V breakdown voltage, 160A pulsed drain current, and a low on-resistance of 0.035Ω. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,461 parts In-Stock

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2,461

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Vyrian

USA . 1,908 parts In-Stock

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1,908

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Anansix

USA . 1,631 parts In-Stock

1+ parts

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1,631

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,198 parts In-Stock

1+ parts

$0.934

100+ parts

-

1k+ parts

$0.840

10k+ parts

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2,198

$0.934

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$0.840

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MKK Technologies

India . 1,869 parts In-Stock

1+ parts

$1.756

100+ parts

-

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1,869

$1.756

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DigiPath Technology Company

USA . 1,869 parts In-Stock

1+ parts

$1.756

100+ parts

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10k+ parts

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1,869

$1.756

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Corphita

USA . 2,140 parts In-Stock

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2,140

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Parana Technologies

USA . 1,692 parts In-Stock

1+ parts

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$1.116

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1,692

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$1.116

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Overview

Unlock unparalleled performance with the STP40N05FI from STMicroelectronics—a trusted name in innovative semiconductor solutions. Designed for efficiency, this N-channel power FET seamlessly handles high currents while ensuring reliable switching applications. Benefit from its robust build and excellent thermal management, making it ideal for automotive, industrial, and consumer electronics. Elevate your projects with a component that combines quality, reliability, and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight yet durable solution, making it ideal for compact designs.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better efficiency and performance, making them suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces component count, enhancing reliability.

Transistor Application: SWITCHING

Designed for efficient switching applications, this FET can be used in various control and power conversion scenarios.

Minimum DS Breakdown Voltage: 50 V

A minimum breakdown voltage of 50V ensures robust performance in applications involving higher voltage levels.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement in circuits and enhances thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure stable and secure connections, which is beneficial for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over conduction, ensuring higher efficiency and lower power loss.

Maximum Pulsed Drain Current (IDM): 160 A

A high pulsed drain current capability allows this FET to handle significant power surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 300 mJ

With a good avalanche energy rating, this FET can manage transient events effectively, enhancing durability.

Maximum Drain Current (Abs) (ID): 23 A

The maximum drain current rating supports high current applications, essential for modern power electronics.

No. of Terminals: 3

Three terminals simplify connections and integration into various circuit designs.

Maximum Power Dissipation (Abs): 40 W

A high power dissipation capability allows for effective thermal management, maintaining performance in high-load conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides additional mechanical stability, which is crucial in industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-speed operation and low on-state resistance, ideal for efficiency.

Maximum Power Dissipation Ambient: 35 W

This specification highlights the FET's capability to function efficiently in various ambient conditions.

Maximum Operating Temperature: 175 °C

With a high operating temperature limit, this FET is suitable for applications in harsh environments.

Transistor Element Material: SILICON

Silicon is a reliable and widely used material in semiconductor devices, ensuring stable performance.

Maximum Turn On Time (ton): 165 ns

Fast turn-on time is essential for high-frequency applications, ensuring quick response and increased performance.

Terminal Finish: MATTE TIN

Matte tin terminal finishing promotes good solderability, leading to reliable connections.

Maximum Drain Current (ID): 22 A

Allowing up to 22A ensures it can deliver substantial power, making it versatile for various applications.

Maximum Drain-Source On Resistance: 0.035 ohm

Low on-resistance minimizes power loss during operation, contributing to overall circuit efficiency.

Terminal Position: SINGLE

Single terminal position simplifies installation and circuit layout.

Case Connection: ISOLATED

Isolated case connection prevents unwanted interactions with other components, enhancing system reliability.

Maximum Feedback Capacitance (Crss): 250 pF

A low feedback capacitance value supports high-frequency switching applications, improving system response.

Technical Specifications

Power Field Effect Transistors (FET) STP40N05FI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

250 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

35 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

165 ns

Trade Compliance

STP40N05FI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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