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STP40N03L-20

STMicroelectronics

STP40N03L-20 by STMicroelectronics

STP40N03L-20 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 40 A, breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,862 parts In-Stock

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3,862

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Vyrian

USA . 2,780 parts In-Stock

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2,780

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Anansix

USA . 804 parts In-Stock

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804

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 760 parts In-Stock

1+ parts

$1.266

100+ parts

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$1.139

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760

$1.266

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$1.139

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MKK Technologies

India . 72 parts In-Stock

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$2.380

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72

$2.380

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DigiPath Technology Company

USA . 72 parts In-Stock

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$2.380

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72

$2.380

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,539 parts In-Stock

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1,539

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Parana Technologies

USA . 1,359 parts In-Stock

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$1.514

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1,359

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$1.514

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Overview

Unlock unparalleled performance with the STP40N03L-20 from STMicroelectronics, a leader in innovation and quality. This N-channel power FET is engineered for efficient switching applications, ensuring reliability and durability. Ideal for demanding environments, it provides exceptional power management with minimal heat dissipation. Experience the superior build and proven reliability of STMicroelectronics in your next project, and elevate your designs with this high-performance transistor!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance in terms of switching speed and efficiency, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse polarity protection, simplifying the circuit design and enhancing reliability.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can effectively handle rapid on/off transitions, making it ideal for power control.

Minimum DS Breakdown Voltage: 30 V

A minimum DS breakdown voltage of 30V provides flexibility for use in diverse voltage conditions, ensuring compatibility with various systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on printed circuit boards, facilitating easier design integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections and are ideal for high-power applications, enhancing mechanical stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides lower on-resistance and improved efficiency during switching, making it a preferred choice for power applications.

Maximum Pulsed Drain Current (IDM): 160 A

The high pulsed drain current rating allows the FET to handle large current spikes, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 300 mJ

A high avalanche energy rating reduces the risk of failure during transient conditions, increasing overall reliability.

Maximum Drain Current (Abs) (ID): 40 A

The rated continuous drain current of 40A ensures reliable performance in high-current applications, providing a solid choice for power management.

No. of Terminals: 3

Three terminals provide simple connection points for circuit integration, making this FET easy to implement in designs.

Maximum Power Dissipation (Abs): 90 W

A high power dissipation capability allows the FET to handle substantial power loads, providing flexibility in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables secure installation and better thermal management, which is essential for high-power devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low gate drive power and high input impedance, making the FET highly efficient and easy to drive.

Maximum Operating Temperature: 175 °C

A high operating temperature range indicates robustness under harsh conditions, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon technology provides good thermal conductivity and stability, ensuring reliable performance in various environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-lasting connections.

Maximum Drain Current (ID): 40 A

Reiterating the capability for continuous current handling, this feature bolsters the FET's versatility in high-current scenarios.

Maximum Drain-Source On Resistance: 0.023 ohm

A low on resistance ensures minimal power loss during operation, enhancing the efficiency of the device significantly.

Terminal Position: SINGLE

The single terminal position simplifies the layout of the device in circuits, promoting straightforward and organized designs.

Technical Specifications

Power Field Effect Transistors (FET) STP40N03L-20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP40N03L-20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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