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STP40N10

STMicroelectronics

STP40N10 by STMicroelectronics

STP40N10 from STMicroelectronics is a powerful N-channel FET ideal for switching applications. It features a max drain current of 40 A, breakdown voltage of 100 V, and operates at up to 175 °C. Its compact design ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,600 parts In-Stock

1+ parts

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2,600

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Anansix

USA . 1,671 parts In-Stock

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1,671

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Vyrian

USA . 1,643 parts In-Stock

1+ parts

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1,643

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

1+ parts

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50

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LittleDiode

UK . 1 parts In-Stock

1+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,382 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

$0.975

10k+ parts

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1,382

$1.083

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$0.975

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MKK Technologies

India . 1,230 parts In-Stock

1+ parts

$2.036

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1,230

$2.036

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DigiPath Technology Company

USA . 1,230 parts In-Stock

1+ parts

$2.036

100+ parts

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1,230

$2.036

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Corphita

USA . 3,334 parts In-Stock

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3,334

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Parana Technologies

USA . 1,117 parts In-Stock

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100+ parts

$1.295

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1,117

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$1.295

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of efficiency with the STP40N10 from STMicroelectronics—your go-to N-channel power FET for robust switching applications. Renowned for top-notch quality and reliability, STMicroelectronics delivers innovative solutions that drive performance across various industries. Experience enhanced energy management, minimal on-resistance, and superior thermal handling, ensuring your projects thrive in demanding environments. Elevate your designs with ST's cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this FET reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer higher conductivity and switching speeds compared to their P-channel counterparts, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy reverse handling of currents, which enhances the robustness of the design in applications such as motor control.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is perfect for tasks requiring rapid on-off states, contributing to efficient power management.

Minimum DS Breakdown Voltage: 100 V

A breakdown voltage of 100V indicates this FET can handle high voltage levels, ensuring safety and reliability in demanding applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of space on PCBs and enables easier mounting on various devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and simplifies the soldering process for PCB assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows the FET to remain off until a gate voltage is applied, offering better control over the switching behavior.

Maximum Pulsed Drain Current (IDM): 160 A

The ability to handle pulsed drain currents of up to 160A makes this FET suitable for high-power applications, ensuring sustained performance under stressful conditions.

Avalanche Energy Rating (EAS): 210 mJ

A high avalanche energy rating allows this FET to tolerate sudden electrical surges, thus increasing reliability and safety in electronic circuits.

Maximum Drain Current (Abs) (ID): 40 A

The maximum allowable drain current of 40A ensures safe operation under demanding conditions, making it suitable for high-current applications.

No. of Terminals: 3

Three terminals provide essential connectivity options while simplifying circuit design and layout.

Maximum Power Dissipation (Abs): 150 W

A power dissipation capability of 150W ensures that the FET can operate effectively without overheating, enhancing overall system reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure attachment to heatsinks or circuit boards, facilitating improved thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high efficiency and low power consumption, making this FET suitable for energy-sensitive applications.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C allows this FET to function in high-heat environments without performance degradation.

Transistor Element Material: SILICON

Silicon as the primary material allows for excellent semiconductor properties, contributing to consistent and reliable electrical performance.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, ensuring long-term reliability in electronic assemblies.

Maximum Drain Current (ID): 40 A

Reiterating the maximum drain current capability of 40A highlights its consistent performance and reliability under high current conditions.

Maximum Drain-Source On Resistance: 0.04 ohm

0.04 ohm on-resistance results in minimal power loss during operation, making this FET efficient for various power applications.

Terminal Position: SINGLE

Single terminal positioning simplifies integration into circuits and enhances design flexibility.

Technical Specifications

Power Field Effect Transistors (FET) STP40N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

210 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP40N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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