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STP40N20FP

STMicroelectronics

STP40N20FP by STMicroelectronics

STP40N20FP by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 40 A and a breakdown voltage of 200 V. It operates in enhancement mode with a low on-resistance of 0.045 Ω. This robust transistor supports high power dissipation up to 40 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,211 parts In-Stock

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2,211

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Anansix

USA . 1,721 parts In-Stock

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1,721

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Digiode

USA . 648 parts In-Stock

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648

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,713 parts In-Stock

1+ parts

$1.077

100+ parts

-

1k+ parts

$0.970

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1,713

$1.077

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$0.970

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MKK Technologies

India . 1,847 parts In-Stock

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$2.026

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1,847

$2.026

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DigiPath Technology Company

USA . 1,847 parts In-Stock

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$2.026

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1,847

$2.026

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Corphita

USA . 4,817 parts In-Stock

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4,817

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Parana Technologies

USA . 85 parts In-Stock

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$1.288

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85

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$1.288

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Overview

Elevate your designs with the STP40N20FP from STMicroelectronics, a powerhouse in power FET technology. Renowned for unmatched reliability and performance, this N-channel transistor excels in demanding switching applications, delivering exceptional efficiency and durability. With STMicroelectronics' commitment to innovation and quality, you gain not just a component but a trusted partner that enhances system resilience while optimizing energy consumption—perfect for automotive, industrial, and consumer electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable construction, ensuring reliability in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for lower on-resistance and faster switching speeds, making them efficient for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances performance by providing inherent protection against reverse voltage.

Transistor Application: SWITCHING

Optimized for switching applications, this FET ensures fast response times and is suitable for power management systems.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage allows this transistor to operate safely in high-voltage applications, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for efficient space utilization on PCB layouts, facilitating better design integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, ideal for high current applications and easy soldering.

Operating Mode: ENHANCEMENT MODE

The enhancement mode ensures that the device remains off when no gate voltage is applied, allowing for safer operation in various circuits.

Maximum Pulsed Drain Current (IDM): 160 A

A high pulsed drain current capability makes this FET suitable for applications that require strong performance under dynamic conditions.

Avalanche Energy Rating (EAS): 230 mJ

The significant avalanche energy rating means this FET can handle energy spikes without failure, increasing durability.

Maximum Drain Current (Abs) (ID): 40 A

With a maximum current rating of 40 A, this FET is capable of handling substantial loads efficiently.

No. of Terminals: 3

The 3-terminal configuration offers simplicity in design, which is advantageous for many electronic applications.

Maximum Power Dissipation (Abs): 40 W

This FET can dissipate significant power, which helps in maintaining performance without overheating, even in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances thermal conductivity and makes the installation process straightforward while securing the device effectively.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides better scalability and lower power consumption, making it suitable for modern electronic devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to function reliably in demanding environments and applications.

Transistor Element Material: SILICON

Silicon as a key material is well-established, offering good thermal stability and electrical performance in various applications.

Maximum Drain Current (ID): 40 A

Consistent with the absolute rating, this ensures reliability under continuous operation conditions.

Maximum Drain-Source On Resistance: 0.045 ohm

Low on-resistance translates to minimal power loss when the device is conducting, improving overall efficiency in circuits.

Terminal Position: SINGLE

A single terminal position enhances the product's versatility and ease of integration into various designs.

Case Connection: ISOLATED

Isolated case connections minimize the risk of short circuits, ensuring safer operation in sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STP40N20FP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP40N20FP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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