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STM819MDS6F

STMicroelectronics

STM819MDS6F by STMicroelectronics

STM819MDS6F from STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1V to 5.5V, with a max temp of 85 °C and features an 8-terminal gull-wing package. Ideal for efficient power supply support in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,787 parts In-Stock

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4,787

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Vyrian

USA . 2,121 parts In-Stock

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2,121

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Anansix

USA . 556 parts In-Stock

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556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,066 parts In-Stock

1+ parts

$4.745

100+ parts

-

1k+ parts

$4.271

10k+ parts

-

2,066

$4.745

-

$4.271

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Microchip USA

USA . 464 parts In-Stock

1+ parts

$7.121

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-

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464

$7.121

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MKK Technologies

India . 310 parts In-Stock

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$8.923

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310

$8.923

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DigiPath Technology Company

USA . 310 parts In-Stock

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$8.923

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310

$8.923

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AZTECH Wire

Italy . 1,040 parts In-Stock

1+ parts

$19.520

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1,040

$19.520

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Vigor

Singapore . 6,960 parts In-Stock

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6,960

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Corphita

USA . 3,343 parts In-Stock

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3,343

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Parana Technologies

USA . 1,896 parts In-Stock

1+ parts

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$5.674

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1,896

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$5.674

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Overview

Elevate your designs with the STM819MDS6F from STMicroelectronics, a leader in power management solutions. This compact, reliable IC guarantees superior performance across a wide temperature range, making it perfect for industrial applications. With its robust packaging and low power consumption, the STM819MDS6F enhances efficiency while ensuring longevity. Trust in STMicroelectronics’ commitment to quality and innovation to empower your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the IC lightweight and cost-effective while providing good mechanical protection.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and enables automated manufacturing processes, enhancing production efficiency.

Package Shape: SQUARE

A square package shape helps in uniform thermal distribution and simplifies PCB layout, making it easier to integrate into various designs.

Nominal Supply Voltage (Vsup): 5 V

5V is a commonly used standard supply voltage, making it compatible with a wide range of devices and applications.

Power Supplies (V): 5

The specification indicates compatibility with common power supply standards, ensuring versatility in application.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for various functionalities while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design is ideal for space-constrained applications, supporting modern electronic designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for industrial applications that may experience elevated temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme environmental conditions, making this ideal for outdoor or rugged applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and prevents oxidation, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible layout options on the PCB, accommodating various design needs.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a compact overall package, making it suitable for miniaturized electronic devices.

Width: 3 mm

The 3mm width is ideal for space-limited applications and facilitates high-density PCB designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is essential for managing voltage levels, making it crucial in power management systems.

Minimum Supply Voltage (Vsup): 1 V

The low minimum supply voltage allows for use in a variety of low-power applications and enhances flexibility in design.

Length: 3 mm

The compact length facilitates integration into slim devices and helps manage board space efficiently.

Nominal Threshold Voltage (V): +4.4V

A threshold voltage of +4.4V allows the IC to effectively manage voltage levels in sensitive applications.

Temperature Grade: INDUSTRIAL

Being graded for industrial use indicates reliability and performance in demanding applications, adding trustworthiness to your design.

Maximum Supply Current (Isup): 0.06 mA

The low maximum supply current helps in reducing overall power consumption, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical connections and ease of soldering, ensuring good performance during assembly.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch allows for high-density packaging without sacrificing the ease of fabrication, compatible with modern PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides a safe margin for voltage fluctuations in typical application environments.

Technical Specifications

Power Management ICs STM819MDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.4V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Width (mm):

3 mm

Trade Compliance

STM819MDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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