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STM819LDS6E

STMicroelectronics

STM819LDS6E by STMicroelectronics

STM819LDS6E by STMicroelectronics is a compact power management IC with a 5V nominal voltage and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package, ideal for industrial applications. This device supports efficient power supply circuits in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,214 parts In-Stock

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5,214

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Anansix

USA . 2,630 parts In-Stock

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2,630

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Digiode

USA . 1,656 parts In-Stock

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1,656

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Distributors (Availability)

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Andel Nordic

Denmark . 3,511 parts In-Stock

1+ parts

$5.609

100+ parts

-

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$5.385

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$5.385

3,511

$5.609

-

$5.385

$5.385

Microchip USA

USA . 375 parts In-Stock

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$14.643

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375

$14.643

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IDEA Electronic Components Group

UK . 1,857 parts In-Stock

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$17.603

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$15.843

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1,857

$17.603

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$15.843

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AZTECH Wire

Italy . 595 parts In-Stock

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$18.430

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595

$18.430

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MKK Technologies

India . 313 parts In-Stock

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$33.102

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313

$33.102

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DigiPath Technology Company

USA . 313 parts In-Stock

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$33.102

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Component Stockers USA

USA . 662 parts In-Stock

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$99.990

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662

$99.990

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Vigor

Singapore . 6,462 parts In-Stock

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Corphita

USA . 2,301 parts In-Stock

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2,301

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Parana Technologies

USA . 2,273 parts In-Stock

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$21.047

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2,273

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$21.047

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Overview

Elevate your designs with the STM819LDS6E from STMicroelectronics—a powerhouse in Power Management ICs. Engineered for reliability and durability, this compact solution excels in industrial applications, ensuring optimal performance even in extreme temperatures. With its sleek, space-saving design and high efficiency, it empowers engineers to create smarter, more efficient systems. Trust STMicroelectronics for superior quality and innovation, and unlock new possibilities in your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and facilitates automated assembly, making it ideal for high-density applications.

Package Shape: SQUARE

Square shapes enable efficient circuit layout and optimize space utilization on PCB, improving overall design flexibility.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is common in many digital circuits, ensuring compatibility and ease of integration with existing systems.

Power Supplies (V): 5

Designed to operate efficiently with a supply voltage of 5 V, making it suitable for a plethora of power management applications.

No. of Terminals: 8

With 8 terminals, it provides ample connectivity options for versatile circuit configurations, enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for space-saving designs, especially in compact electronic devices.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability and performance in a wide range of industrial environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40 °C makes this device suitable for applications in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in routing signals and power within the circuit for improved performance.

Maximum Seated Height: 1.1 mm

A low seated height allows for a thinner overall package profile, which is advantageous for compact designs.

Width: 3 mm

The compact width of 3 mm supports high-density layouts, enabling efficient use of PCB real estate.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is specifically designed to maintain stable power levels, essential for reliable circuit operation.

Minimum Supply Voltage (Vsup): 1 V

With a minimum supply voltage of 1 V, this IC is adaptable to low-power applications, enhancing its versatility.

Length: 3 mm

The length of 3 mm further contributes to compactness, allowing for space-efficient placements on PCBs.

Nominal Threshold Voltage (V): +4.65V

The nominal threshold voltage is well-suited for controlling logic levels in numerous electronic applications.

Temperature Grade: INDUSTRIAL

Classified as industrial grade, it is designed for robust performance in challenging environmental conditions.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current enhances power efficiency, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form enables easy soldering and enhances the reliability of connections during assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is optimized for modern PCB designs, allowing for a compact placement of components.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures the device can handle peaks and fluctuations, maintaining reliability in varying conditions.

Technical Specifications

Power Management ICs STM819LDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.65V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.65V

Width (mm):

3 mm

Trade Compliance

STM819LDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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