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STM818MM6E

STMicroelectronics

STM818MM6E by STMicroelectronics

STM818MM6E by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports industrial applications. Ideal for efficient power supply management, it ensures reliability in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,864 parts In-Stock

1+ parts

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7,864

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Digiode

USA . 3,157 parts In-Stock

1+ parts

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3,157

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Anansix

USA . 2,480 parts In-Stock

1+ parts

-

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2,480

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Bristol Electronics

USA . 200 parts In-Stock

1+ parts

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200

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Dan-Mar Components

USA . 200 parts In-Stock

1+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,296 parts In-Stock

1+ parts

$1.271

100+ parts

-

1k+ parts

$1.143

10k+ parts

-

2,296

$1.271

-

$1.143

-

MKK Technologies

India . 1,674 parts In-Stock

1+ parts

$2.389

100+ parts

-

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1,674

$2.389

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DigiPath Technology Company

USA . 1,674 parts In-Stock

1+ parts

$2.389

100+ parts

-

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10k+ parts

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1,674

$2.389

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Ampacity Inc.

Singapore . 486 parts In-Stock

1+ parts

$6.500

100+ parts

-

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486

$6.500

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AZTECH Wire

Italy . 290 parts In-Stock

1+ parts

$15.020

100+ parts

-

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290

$15.020

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Microchip USA

USA . 322 parts In-Stock

1+ parts

$24.201

100+ parts

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322

$24.201

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Vigor

Singapore . 4,950 parts In-Stock

1+ parts

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4,950

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Corphita

USA . 2,171 parts In-Stock

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2,171

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Parana Technologies

USA . 1,656 parts In-Stock

1+ parts

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$1.519

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1,656

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$1.519

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Overview

Elevate your designs with the STM818MM6E from STMicroelectronics, a leader in power management solutions. This compact IC ensures reliable performance across diverse applications, from industrial automation to consumer electronics. With its robust temperature range and superior quality, it offers unmatched efficiency and stability, empowering you to create innovative products that stand out in today’s competitive market. Discover the benefits of reliability and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials offers robust protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability ensures easy integration into modern PCB designs, optimizing space and manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for compact layouts and efficient use of circuit board real estate.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is a widely used standard in many applications, ensuring compatibility with a range of devices.

Power Supplies (V): 5

Supports 5 V power supplies, making it easy to power this IC with commonly available voltage sources.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity for various functions while maintaining compactness.

Package Style (Meter): SMALL OUTLINE

Small outline package style is ideal for space-constrained applications, allowing for high-density designs.

Maximum Operating Temperature: 85 °C

The capability to operate at up to 85 °C ensures reliable performance in high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for industrial and outdoor applications requiring durability.

Terminal Finish: NICKEL PALLADIUM GOLD

Superior terminal finish provides excellent corrosion resistance and enhances solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing on printed circuit boards, enhancing design versatility.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm contributes to the compactness of PCB designs, allowing for denser arrangements.

Width: 3.9 mm

The narrow width of 3.9 mm is beneficial for densely packed circuits, making it a practical choice for modern electronic devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power supply management, this IC is essential for optimizing energy usage in electronic applications.

Minimum Supply Voltage (Vsup): 1 V

A minimum supply voltage of 1 V allows for operation in low-power applications, extending battery life for portable devices.

Maximum Time At Peak Reflow Temperature (s): 40

Having a maximum time at peak reflow temperature of 40 seconds helps ensure the integrity of the IC during soldering processes.

Peak Reflow Temperature °C: 260

The capability to withstand a peak reflow temperature of 260 °C ensures compatibility with standard soldering processes.

Length: 4.9 mm

At 4.9 mm in length, the IC is suitable for applications where space is at a premium.

Nominal Threshold Voltage (V): +4.4V

A nominal threshold voltage of +4.4 V provides reliable voltage regulation tailored for various electronic circuits.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions, it is reliable for applications exposed to harsh environments.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of only 0.06 mA, this IC is energy-efficient, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent surface mount connectivity, ensuring reliable solder joints and mechanical strength.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances compact size with ease of soldering, suitable for high-density designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in design, accommodating a range of power sources.

Technical Specifications

Power Management ICs STM818MM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM818MM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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