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STM813LM6E

STMicroelectronics

STM813LM6E by STMicroelectronics

STM813LM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 5V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages b/w 1.2V and 5.5V, ideal for industrial applications. Its compact design (3.9mm x 4.9mm) ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,331 parts In-Stock

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4,331

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Digiode

USA . 2,820 parts In-Stock

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2,820

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Cyclops Electronics Ltd

UK . 1,299 parts In-Stock

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1,299

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ComSIT Distribution GmbH

Germany . 1,200 parts In-Stock

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1,200

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Anansix

USA . 426 parts In-Stock

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426

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 384 parts In-Stock

1+ parts

$8.992

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-

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384

$8.992

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Aztec Data Supply Inc.

USA . 25 parts In-Stock

1+ parts

$10.521

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25

$10.521

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IDEA Electronic Components Group

UK . 1,960 parts In-Stock

1+ parts

$17.796

100+ parts

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$16.017

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1,960

$17.796

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$16.017

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AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$21.330

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633

$21.330

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$24.204

100+ parts

$22.026

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$19.847

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750

$24.204

$22.026

$19.847

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MKK Technologies

India . 913 parts In-Stock

1+ parts

$33.465

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913

$33.465

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DigiPath Technology Company

USA . 913 parts In-Stock

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$33.465

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913

$33.465

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A-Z Elektronik GmbH

Germany . 4,917 parts In-Stock

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4,917

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Vigor

Singapore . 4,867 parts In-Stock

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4,867

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Corphita

USA . 3,821 parts In-Stock

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3,821

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Parana Technologies

USA . 338 parts In-Stock

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$21.278

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338

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$21.278

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Overview

Elevate your power management solutions with the STM813LM6E from STMicroelectronics, a trusted leader in innovation. This versatile IC ensures reliable performance across diverse applications, from industrial automation to consumer electronics. With optimal temperature range handling and compact design, it offers exceptional efficiency and durability. Choose STM813LM6E for seamless integration and long-term value, empowering your projects with stability and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and is cost-effective, making it suitable for various applications.

Surface Mount: YES

Supports surface mount technology which is ideal for compact designs and automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and easy routing of traces.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5 V is compatible with a variety of standard electronic devices.

Power Supplies (V): 1.5/5

This flexibility in power supply options allows integration into different system architectures.

No. of Terminals: 8

With 8 terminals, it offers sufficient connectivity for versatile functionalities while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, making it ideal for modern electronic devices.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position enhances the flexibility of PCB layout and component placement.

Maximum Seated Height: 1.75 mm

A low seated height allows for compatibility with low-profile designs, maintaining a sleek appearance.

Width: 3.9 mm

The compact width contributes to a smaller overall device size, important for portable applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specialized as a power supply management circuit, it ensures efficient use of power in devices.

Minimum Supply Voltage (Vsup): 1.2 V

This low minimum supply voltage allows for operation in low-power systems, extending battery life.

Length: 4.9 mm

The short length makes it easy to fit into tight spaces on PCBs without compromising performance.

Nominal Threshold Voltage (V): +4.63V

The nominal threshold voltage provides a reliable reference point for effective power regulation.

Temperature Grade: INDUSTRIAL

Industrial grade components guarantee reliability and durability in demanding applications.

Maximum Supply Current (Isup): 0.06 mA

A low supply current enables energy-efficient operation, crucial for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connections on the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with various PCB designs while maintaining space efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle a maximum supply voltage of 5.5 V ensures compatibility with various power sources, making it a versatile choice.

Technical Specifications

Power Management ICs STM813LM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.63V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Width (mm):

3.9 mm

Trade Compliance

STM813LM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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