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STM812RW16F

STMicroelectronics

STM812RW16F by STMicroelectronics

STM812RW16F by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1.2V to 5.5V and features a max temperature of 85 °C. Its small outline, thin profile makes it ideal for space-constrained designs.

Median Price

$0.594

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,392 parts In-Stock

1+ parts

-

100+ parts

$0.594

1k+ parts

$0.493

10k+ parts

$0.440

9,392

-

$0.594

$0.493

$0.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,483 parts In-Stock

1+ parts

$0.509

100+ parts

-

1k+ parts

-

10k+ parts

-

1,483

$0.509

-

-

-

Chip Stock

USA . 21,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,500

-

-

-

-

Vyrian

USA . 8,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,647

-

-

-

-

Anansix

USA . 2,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,343

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,478 parts In-Stock

1+ parts

$0.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,478

$0.300

-

-

-

Ampacity Inc.

Singapore . 9,739 parts In-Stock

1+ parts

$0.456

100+ parts

-

1k+ parts

-

10k+ parts

-

9,739

$0.456

-

-

-

Corphita

USA . 2,962 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

-

2,962

$0.482

-

-

-

Microchip USA

USA . 5,370 parts In-Stock

1+ parts

$4.073

100+ parts

-

1k+ parts

-

10k+ parts

-

5,370

$4.073

-

-

-

Component Stockers USA

USA . 14,211 parts In-Stock

1+ parts

$10.030

100+ parts

-

1k+ parts

-

10k+ parts

-

14,211

$10.030

-

-

-

IDEA Electronic Components Group

UK . 302 parts In-Stock

1+ parts

$12.250

100+ parts

-

1k+ parts

$11.025

10k+ parts

-

302

$12.250

-

$11.025

-

AZTECH Wire

Italy . 949 parts In-Stock

1+ parts

$13.770

100+ parts

-

1k+ parts

-

10k+ parts

-

949

$13.770

-

-

-

MKK Technologies

India . 1,858 parts In-Stock

1+ parts

$23.035

100+ parts

-

1k+ parts

-

10k+ parts

-

1,858

$23.035

-

-

-

DigiPath Technology Company

USA . 1,858 parts In-Stock

1+ parts

$23.035

100+ parts

-

1k+ parts

-

10k+ parts

-

1,858

$23.035

-

-

-

Assy Fe

Spain . 4,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,051

-

-

-

-

Perfect Parts

USA . 3,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,690

-

-

-

-

Kepictronics

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

-

-

RC Electronics

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

-

-

-

-

Parana Technologies

USA . 367 parts In-Stock

1+ parts

-

100+ parts

$14.646

1k+ parts

-

10k+ parts

-

367

-

$14.646

-

-

Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

300

-

-

-

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GreenTree Electronics

Israel . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

259

-

-

-

-

Overview

Elevate your power management solutions with the STM812RW16F from STMicroelectronics, a trusted leader in innovation and quality. Engineered for reliability and efficiency, this compact IC is perfect for a range of applications—from industrial automation to consumer electronics. With its robust performance across diverse conditions, it ensures stable operations while minimizing power consumption. Experience superior value and uncompromising quality that drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliability and protection against environmental factors, making it ideal for various applications.

Surface Mount: YES

Being surface mount compatible enhances design flexibility and allows for automated assembly, reducing overall manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on PCBs, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V is suitable for a wide range of applications, ensuring compatibility with most digital circuits.

Power Supplies (V): 1.5/5

Compatibility with both 1.5V and 5V power supplies provides versatility in various circuit designs.

No. of Terminals: 4

Having 4 terminals simplifies circuit design while still providing the necessary functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile make it ideal for space-constrained applications, allowing for more compact devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in diverse industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C enables this product to be used in extreme conditions, enhancing its reliability.

Terminal Finish: TIN

The tin terminal finish ensures good solderability and enhances corrosion resistance, improving the longevity of connections.

Terminal Position: DUAL

The dual terminal position provides flexibility in design layout on the PCB.

Maximum Seated Height: 1.12 mm

A maximum seated height of 1.12 mm allows for low-profile designs, which is essential in compact electronics.

Width (mm): 1.3 mm

With a width of just 1.3 mm, this IC is excellent for miniaturized applications without sacrificing performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it ensures stable and efficient performance in managing power within systems.

Minimum Supply Voltage (Vsup): 1.2 V

The minimum supply voltage of 1.2 V allows operation in low-power applications, which is critical for energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum peak reflow time of 30 seconds, it allows for efficient assembly processes without risking thermal damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C supports robust soldering processes necessary for high-quality electronics manufacturing.

Length: 2.92 mm

A compact length of 2.92 mm makes this IC suitable for tight spaces, enhancing design options for OEMs.

Nominal Threshold Voltage (V): +2.63V

The nominal threshold voltage of +2.63V ensures effective power management and circuit stability.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees performance and reliability in demanding environments.

Maximum Supply Current (Isup): 0.015 mA

A maximum supply current of 0.015 mA contributes to low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form aids in reliable soldering and provides excellent mechanical strength to the device.

Terminal Pitch: 1.92 mm

The 1.92 mm terminal pitch allows for easy integration into various circuit layouts without complicating board design.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V gives flexibility to work with a range of circuits, enhancing the versatility of the IC.

Technical Specifications

Power Management ICs STM812RW16F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-253

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.015 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.92 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

STM812RW16F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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