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STM806TM6F

STMicroelectronics

STM806TM6F by STMicroelectronics

STM806TM6F by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, operating from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.1V to 5.5V, ideal for industrial applications. Its compact design ensures efficient space utilization in electronic devices.

Median Price

$1.286

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

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$1.286

2,500

-

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$1.286

Verical

USA . 2,500 parts In-Stock

1+ parts

-

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-

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$1.286

2,500

-

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$1.286

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$1.302

2,500

-

-

-

$1.302

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,123 parts In-Stock

1+ parts

-

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5,123

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Digiode

USA . 2,386 parts In-Stock

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2,386

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Anansix

USA . 1,829 parts In-Stock

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1,829

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$0.780

100+ parts

-

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-

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-

2,500

$0.780

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Microchip USA

USA . 4,268 parts In-Stock

1+ parts

$11.895

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4,268

$11.895

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IDEA Electronic Components Group

UK . 1,992 parts In-Stock

1+ parts

$13.859

100+ parts

-

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$12.473

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-

1,992

$13.859

-

$12.473

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$19.320

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390

$19.320

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MKK Technologies

India . 1,706 parts In-Stock

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$26.061

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1,706

$26.061

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DigiPath Technology Company

USA . 1,706 parts In-Stock

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$26.061

100+ parts

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1,706

$26.061

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QUARKTWIN TECHNOLOGY LTD

USA . 16,729 parts In-Stock

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16,729

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Corphita

USA . 4,359 parts In-Stock

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4,359

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Component Stockers USA

USA . 2,285 parts In-Stock

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2,285

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Metaverse IC Inc.

Canada . 1,900 parts In-Stock

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1,900

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Perfect Parts

USA . 428 parts In-Stock

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428

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Parana Technologies

USA . 146 parts In-Stock

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$16.570

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146

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$16.570

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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50

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Overview

Unlock the potential of your designs with the STM806TM6F from STMicroelectronics, a trusted leader in power management solutions. This compact, reliable IC enhances efficiency for various applications, ensuring optimum performance even in extreme temperatures. With its robust features and industry-leading quality, choose STM806TM6F to elevate your projects, cut down on energy costs, and enjoy the peace of mind that comes with proven reliability and exceptional support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount enables easy integration into modern circuit designs and saves board space.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on PCBs, optimizing layout options.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6V provides a stable operating point for reliable performance.

Power Supplies (V): 3.3/5

Supports dual voltage levels (3.3V and 5V), enhancing versatility for diverse applications.

No. of Terminals: 8

The 8 terminals offer sufficient connection options for integrating with multiple components.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces the footprint on the PCB, ideal for compact designs.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes it suitable for a wide range of industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is suitable for use in extreme environments.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and improves the long-term reliability of the connections.

Terminal Position: DUAL

Dual terminal position simplifies PCB layout and can improve thermal performance.

Maximum Seated Height: 1.75 mm

Low profile (1.75 mm) enables better space management on PCBs.

Width: 3.9 mm

At 3.9 mm wide, it fits well in compact spaces while maintaining performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC is reliable for managing supply voltages.

Minimum Supply Voltage (Vsup): 1.1 V

A minimum supply voltage of 1.1V enables operation in low-power applications, enhancing energy efficiency.

Peak Reflow Temperature °C: 260

A high reflow temperature ensures compatibility with modern soldering processes and enhances durability.

Length: 4.9 mm

Compact length of 4.9 mm allows it to fit within tight spaces on the PCB.

Nominal Threshold Voltage (V): +3.075V

The nominal threshold voltage provides a precise operating point that can improve signal integrity.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh environments.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current of 0.06 mA contributes to energy efficiency and reduces overall power consumption.

Terminal Form: GULL WING

Gull wing terminals offer excellent soldering characteristics, improving assembly reliability.

Terminal Pitch: 1.27 mm

A pitch of 1.27 mm is standard for many applications, simplifying design and manufacturing processes.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates suitable handling with minimal risk of moisture-related damage before assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V, allowing flexibility for various applications requiring higher voltages.

Technical Specifications

Power Management ICs STM806TM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.075V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.075V

Width (mm):

3.9 mm

Trade Compliance

STM806TM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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