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STM805SM6E

STMicroelectronics

STM805SM6E by STMicroelectronics

STM805SM6E by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1.1V to 5.5V, with a max current of 0.06mA and temp range from -40 °C to 85 °C. Its small outline package ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,482 parts In-Stock

1+ parts

-

100+ parts

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8,482

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Anansix

USA . 2,566 parts In-Stock

1+ parts

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2,566

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Digiode

USA . 543 parts In-Stock

1+ parts

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543

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 924 parts In-Stock

1+ parts

$6.110

100+ parts

-

1k+ parts

$5.866

10k+ parts

$5.866

924

$6.110

-

$5.866

$5.866

AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$11.800

100+ parts

-

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-

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-

1,023

$11.800

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IDEA Electronic Components Group

UK . 427 parts In-Stock

1+ parts

$20.054

100+ parts

-

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$18.049

10k+ parts

-

427

$20.054

-

$18.049

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Microchip USA

USA . 313 parts In-Stock

1+ parts

$24.924

100+ parts

-

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313

$24.924

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MKK Technologies

India . 157 parts In-Stock

1+ parts

$37.711

100+ parts

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157

$37.711

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DigiPath Technology Company

USA . 157 parts In-Stock

1+ parts

$37.711

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157

$37.711

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Component Stockers USA

USA . 363 parts In-Stock

1+ parts

$99.990

100+ parts

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363

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Vigor

Singapore . 4,373 parts In-Stock

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4,373

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Corphita

USA . 4,220 parts In-Stock

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4,220

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Parana Technologies

USA . 788 parts In-Stock

1+ parts

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$23.978

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788

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$23.978

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Overview

Elevate your designs with the STM805SM6E from STMicroelectronics, a leading innovator in power management solutions. This compact and reliable IC offers exceptional performance across a range of temperatures, ensuring that your applications run smoothly in any environment. With low power consumption and robust durability, it’s ideal for industrial automation, consumer electronics, and more. Trust STMicroelectronics for quality that enhances efficiency and boosts your product's value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides robustness and protection against environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Surface mount technology enables efficient use of PCB space, allowing for compact designs and improved manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement on PCB, making it versatile for different layouts.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6V ensures compatibility with a variety of power sources, enhancing its applicability in multiple devices.

Power Supplies (V): 3.3/5

Supports dual supply voltages of 3.3V and 5V, allowing flexibility in design and making it suitable for a broader range of applications.

No. of Terminals: 8

Having 8 terminals allows for sufficient connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

Small outline package style is beneficial for saving space on PCBs, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -40 °C

This wide temperature range (up to -40 °C) guarantees functionality in harsh conditions, making it suitable for industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality finish ensures excellent conductivity and resistance to corrosion, ensuring longevity and reliable performance.

Terminal Position: DUAL

Dual terminal positioning offers easier routing on the PCB, simplifying the overall design process.

Maximum Seated Height: 1.75 mm

A low seated height aids in sleek design and better thermal management, beneficial for high-density applications.

Width: 3.9 mm

A compact width means more components can fit into a smaller area, essential for modern electronic designs.

Other IC Type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, it provides essential functionality for efficient power distribution, crucial in power-sensitive applications.

Minimum Supply Voltage (Vsup): 1.1 V

Supporting a low minimum supply voltage increases compatibility with a wider variety of devices, especially low power applications.

Maximum Time At Peak Reflow Temperature: 40 s

The capability to withstand peak reflow temperatures enhances manufacturing efficiency while maintaining component integrity.

Peak Reflow Temperature: 260 °C

High peak reflow temperature resilience makes this IC suitable for the latest soldering technologies, ensuring reliable assembly.

Length: 4.9 mm

A short length helps in reducing trace lengths on PCBs, which can enhance performance by minimizing signal delays.

Nominal Threshold Voltage: +2.925V

The nominal threshold voltage provides precise voltage control for stable operation, critical in power management applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates durability and reliability in extreme conditions, suitable for various demanding applications.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current ensures energy efficiency, which is ideal for battery-operated and energy-sensitive devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability, enhancing reliability in electrical connections.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows compatibility with many PCB designs, simplifying integration into existing systems.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a maximum supply voltage of 5.5V makes this IC versatile and able to interface with both modern and legacy systems.

Technical Specifications

Power Management ICs STM805SM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.925V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM805SM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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