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STM804TM6E

STMicroelectronics

STM804TM6E by STMicroelectronics

STM804TM6E by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1.1V to 5.5V, with a max current of 0.06mA and supports temperatures from -40 °C to 85 °C. Its small outline package ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,599 parts In-Stock

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4,599

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Vyrian

USA . 3,307 parts In-Stock

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3,307

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Anansix

USA . 632 parts In-Stock

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632

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$3.111

100+ parts

-

1k+ parts

$2.800

10k+ parts

-

273

$3.111

-

$2.800

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Microchip USA

USA . 114 parts In-Stock

1+ parts

$3.970

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-

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114

$3.970

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MKK Technologies

India . 2,257 parts In-Stock

1+ parts

$5.851

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2,257

$5.851

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DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

$5.851

100+ parts

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2,257

$5.851

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AZTECH Wire

Italy . 736 parts In-Stock

1+ parts

$21.720

100+ parts

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736

$21.720

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Component Stockers USA

USA . 720 parts In-Stock

1+ parts

$99.990

100+ parts

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720

$99.990

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A-Z Elektronik GmbH

Germany . 6,980 parts In-Stock

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6,980

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Corphita

USA . 3,050 parts In-Stock

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3,050

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 1,900 parts In-Stock

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1,900

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Parana Technologies

USA . 104 parts In-Stock

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$3.720

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104

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$3.720

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Overview

Unlock the potential of your designs with the STM804TM6E from STMicroelectronics, a leader in power management solutions. This compact powerhouse efficiently regulates voltage for a wide array of applications, ensuring reliability and performance even in challenging environments. With robust temperature resilience and surface mount capability, it’s perfect for industrial settings. Elevate your projects today with unmatched quality and support from a trusted manufacturer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and effective thermal dissipation, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller board designs and automated assembly processes, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape aids in space-efficient design and better fit on circuit boards.

Nominal Supply Voltage (Vsup): 3.6 V

With a nominal supply voltage of 3.6 V, this IC is versatile for different applications that require stable performance.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies, this IC can easily be integrated into existing systems, enhancing design flexibility.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space usage on the PCB, making it ideal for compact applications.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C ensures reliability in demanding environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this IC suitable for industrial applications where extreme conditions are common.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This premium terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for better layout options on PCBs, improving electrical performance.

Maximum Seated Height: 1.75 mm

A low seated height helps in maintaining slim designs while providing stability in mounting.

Width: 3.9 mm

The compact width means it can fit easily into small and intricate electronic designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power supply management, this IC optimizes power usage with efficiency in mind.

Minimum Supply Voltage (Vsup): 1.1 V

Support for low minimum supply voltage makes the IC suitable for low-power applications, enhancing battery life.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time at peak reflow temperature of 40 seconds, this IC is compatible with standard soldering processes.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature ensures reliability during assembly, making it suitable for robust manufacturing processes.

Length: 4.9 mm

The compact length supports efficient use of PCB space without sacrificing performance.

Nominal Threshold Voltage (V): +3.075V

The nominal threshold voltage optimizes performance in a range of applications, ensuring accurate power management.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this IC ensures consistent performance in challenging environments.

Maximum Supply Current (Isup): 0.06 mA

The low maximum supply current of 0.06 mA contributes to minimal power consumption, ideal for energy-sensitive designs.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical strength and ease of soldering, enhancing the overall durability of connections.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch enables compatibility with a wide range of PCB layouts, offering design flexibility.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5 V allows flexibility in interfacing with different electronic systems.

Technical Specifications

Power Management ICs STM804TM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.075V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.075V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM804TM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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