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STM804RM6E

STMicroelectronics

STM804RM6E by STMicroelectronics

STM804RM6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3.6V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.1V to 5.5V, ideal for industrial applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,780 parts In-Stock

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5,780

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Anansix

USA . 497 parts In-Stock

1+ parts

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497

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Digiode

USA . 344 parts In-Stock

1+ parts

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344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 384 parts In-Stock

1+ parts

$3.091

100+ parts

-

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384

$3.091

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AZTECH Wire

Italy . 1,031 parts In-Stock

1+ parts

$8.890

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1,031

$8.890

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$19.237

100+ parts

-

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$17.313

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2,292

$19.237

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$17.313

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MKK Technologies

India . 710 parts In-Stock

1+ parts

$36.174

100+ parts

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710

$36.174

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DigiPath Technology Company

USA . 710 parts In-Stock

1+ parts

$36.174

100+ parts

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710

$36.174

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A-Z Elektronik GmbH

Germany . 6,335 parts In-Stock

1+ parts

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6,335

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Corphita

USA . 2,475 parts In-Stock

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2,475

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Kepictronics

USA . 1,900 parts In-Stock

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1,900

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Vigor

Singapore . 1,091 parts In-Stock

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1,091

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Parana Technologies

USA . 336 parts In-Stock

1+ parts

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$23.001

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336

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$23.001

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Overview

Elevate your power management solutions with the STM804RM6E from STMicroelectronics, a trusted leader in innovative electronics. This compact, reliable IC is designed for efficiency and durability, operating seamlessly in extreme temperatures for industrial applications. With its superior build quality and versatile voltage range, the STM804RM6E provides exceptional performance, ensuring your devices run smoothly while minimizing energy consumption. Unlock the potential of your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package durable and suitable for a variety of environments, ensuring reliability in performance.

Surface Mount: YES

Surface mount technology enables efficient PCB space utilization and allows for automated manufacturing processes, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape of the package facilitates easy integration into designs and improves layout flexibility on PCBs.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V is ideal for many applications, providing a stable reference while maintaining efficiency.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies increases versatility, allowing the IC to be used in a wide range of applications.

No. of Terminals: 8

With 8 terminals, the IC accommodates a range of functionalities while maintaining a compact design, ideal for space-constrained applications.

Package Style (Meter): SMALL OUTLINE

The small outline design reduces overall space requirements on the PCB, making it suitable for compact devices.

Maximum Operating Temperature: 85 °C

An operational temperature of 85 °C ensures the IC can perform reliably in environments with moderate heat exposure.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this IC suitable for industrial applications that require performance in harsh climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Ni/Pd/Au finish enhances solderability and improves corrosion resistance, leading to better long-term reliability.

Terminal Position: DUAL

Dual terminal positioning aids in flexible PCB layout and orientation options, allowing for easier integration in designs.

Maximum Seated Height: 1.75 mm

A low seated height minimizes the profile of the component, enhancing design aesthetics and fitting into slim devices.

Width: 3.9 mm

A compact width of 3.9 mm allows the IC to fit easily into tight spaces, contributing to compact overall product design.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is essential for efficient energy management in electronic devices, extending battery life.

Minimum Supply Voltage (Vsup): 1.1 V

The capability to operate at a minimum supply voltage of 1.1 V allows for use in low-power applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum peak reflow time of 40 seconds ensures compatibility with various soldering processes, enhancing manufacturability.

Peak Reflow Temperature: 260 °C

With a peak reflow temperature of 260 °C, this IC can withstand modern soldering methods, ensuring robust assembly processes.

Length: 4.9 mm

A length of 4.9 mm contributes to a compact IC design, permitting integration into smaller devices without losing functionality.

Nominal Threshold Voltage: +2.625V

A nominal threshold voltage of 2.625 V enables precise voltage regulation, enhancing performance in power supply applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this IC ensures robust operation in demanding environments, suitable for industrial applications.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of 0.06 mA signifies low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capability, promoting reliable connections and ease of assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB layouts, facilitating easy incorporation into existing designs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a maximum supply voltage of 5.5 V increases its application range, accommodating various devices and systems.

Technical Specifications

Power Management ICs STM804RM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM804RM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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