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STM708DS6E

STMicroelectronics

STM708DS6E by STMicroelectronics

STM708DS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates in extreme temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing design and supports voltages b/w 1.2V and 5.5V, ideal for industrial applications. Its small outline package ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,278 parts In-Stock

1+ parts

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3,278

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Anansix

USA . 2,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,695

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Digiode

USA . 2,097 parts In-Stock

1+ parts

-

100+ parts

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2,097

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,291 parts In-Stock

1+ parts

$3.087

100+ parts

-

1k+ parts

$2.778

10k+ parts

-

2,291

$3.087

-

$2.778

-

MKK Technologies

India . 63 parts In-Stock

1+ parts

$5.804

100+ parts

-

1k+ parts

-

10k+ parts

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63

$5.804

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DigiPath Technology Company

USA . 63 parts In-Stock

1+ parts

$5.804

100+ parts

-

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63

$5.804

-

-

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Microchip USA

USA . 208 parts In-Stock

1+ parts

$10.259

100+ parts

-

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208

$10.259

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AZTECH Wire

Italy . 738 parts In-Stock

1+ parts

$20.890

100+ parts

-

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738

$20.890

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Vigor

Singapore . 5,445 parts In-Stock

1+ parts

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5,445

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Corphita

USA . 2,225 parts In-Stock

1+ parts

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2,225

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Parana Technologies

USA . 596 parts In-Stock

1+ parts

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100+ parts

$3.690

1k+ parts

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596

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$3.690

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Overview

Elevate your power management solutions with the STM708DS6E from STMicroelectronics, a leader in innovative semiconductor technology. This compact, reliable IC is designed for versatility, operating efficiently across a wide temperature range. Perfect for industrial applications, it offers exceptional performance while ensuring minimal energy consumption. Trust in STMicroelectronics’ commitment to quality and innovation—unlock unparalleled power efficiency and reliability for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the IC suitable for long-term applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, making it ideal for modern electronic devices.

Package Shape: SQUARE

The square shape contributes to efficient space utilization on the PCB and aids in thermal management.

Nominal Supply Voltage (Vsup): 5 V

The standard nominal supply voltage of 5V makes this IC compatible with a wide range of electronic systems.

Power Supplies (V): 1.5/5

This flexibility in power supply options allows the IC to be used in various applications with different voltage requirements.

No. of Terminals: 8

Having 8 terminals offers balanced functionality while still being manageable in terms of layout and design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are optimal for high-density circuit designs where space is at a premium.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for applications in moderately harsh environments.

Minimum Operating Temperature: -40 °C

The capability to operate as low as -40 °C allows this IC to be employed in extreme temperature conditions, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances electrical performance, prevents oxidation, and ensures reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layouts, which is beneficial for both design simplicity and performance.

Maximum Seated Height: 1.1 mm

A low maximum seated height ensures that the IC occupies minimal vertical space, which is advantageous for compact designs.

Width: 3 mm

The 3 mm width strikes a balance between size and functionality, fitting well in many compact applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is critical in ensuring stable power delivery, making it essential for reliable performance.

Minimum Supply Voltage (Vsup): 1.2 V

The capability to operate at a minimum supply voltage of 1.2V provides flexibility for battery-operated and low-power applications.

Length: 3 mm

A length of 3 mm is ideal for maintaining a compact design, compatible with various devices.

Nominal Threshold Voltage (V): +4.38V

A specific nominal threshold voltage improves performance consistency and predictability in applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade rating ensures this IC can handle demanding environments typical in industrial applications.

Maximum Supply Current (Isup): 0.06 mA

With a low maximum supply current demand, this IC contributes to energy efficiency, making it suitable for battery-powered designs.

Terminal Form: GULL WING

Gull wing terminal form aids in reliable soldering during assembly, ensuring solid electrical connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for standard PCB layouts, enhancing design compatibility.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides reassurance for overvoltage protection, ensuring long-term reliability.

Technical Specifications

Power Management ICs STM708DS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

THRESHOLD VOLTAGE IS 4.38V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Width (mm):

3 mm

Trade Compliance

STM708DS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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