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STM706SDS6F

STMicroelectronics

STM706SDS6F by STMicroelectronics

STM706SDS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages up to 5.5V. Ideal for industrial applications, it ensures efficient power management in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,892 parts In-Stock

1+ parts

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3,892

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Digiode

USA . 3,805 parts In-Stock

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3,805

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Anansix

USA . 1,156 parts In-Stock

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1,156

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 234 parts In-Stock

1+ parts

$9.630

100+ parts

-

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234

$9.630

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Microchip USA

USA . 248 parts In-Stock

1+ parts

$14.526

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248

$14.526

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IDEA Electronic Components Group

UK . 2,060 parts In-Stock

1+ parts

$16.611

100+ parts

-

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$14.950

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2,060

$16.611

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$14.950

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MKK Technologies

India . 966 parts In-Stock

1+ parts

$31.235

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966

$31.235

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DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$31.235

100+ parts

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966

$31.235

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A-Z Elektronik GmbH

Germany . 6,633 parts In-Stock

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6,633

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,440 parts In-Stock

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2,440

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Parana Technologies

USA . 1,252 parts In-Stock

1+ parts

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$19.860

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1,252

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$19.860

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Overview

Elevate your designs with the STM706SDS6F from STMicroelectronics, a trusted leader in power management solutions. This compact and reliable IC ensures optimal performance across diverse applications, from industrial to consumer electronics. Enjoy superior thermal stability and minimal power consumption, enhancing efficiency without compromise. Choose STM706SDS6F for unparalleled quality and innovation that drives your projects forward with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy body material ensures durability and resistance to environmental stress, which is essential for reliable performance.

Surface Mount: YES

Surface mount capability allows for a compact design and ease of integration onto PCBs, making it suitable for modern electronic applications.

Package Shape: SQUARE

The square package shape optimizes the layout on a printed circuit board, enhancing space efficiency.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is standard for many digital circuits, providing compatibility with a wide range of devices.

Power Supplies (V): 3.3/5

The ability to support both 3.3V and 5V power supplies offers versatility for various applications and ease of integration.

No. of Terminals: 8

With 8 terminals, this IC provides multiple connection points for enhanced functionality while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This small and thin package style allows for higher density designs in compact electronic systems.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this IC suitable for industrial applications where moderate heat is expected.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this component is ideal for use in harsh environments and extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and can simplify the manufacturing process.

Maximum Seated Height: 1.1 mm

A maximum seated height of 1.1 mm contributes to the low-profile design, making it ideal for space-constrained applications.

Width: 3 mm

A compact width of 3 mm allows for dense placement on PCBs, maximizing space utilization.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC provides efficient power regulation, enhancing the overall performance of the system.

Minimum Supply Voltage (Vsup): 1.2 V

A low minimum supply voltage of 1.2V broadens its application range, especially in low-power electronics.

Length: 3 mm

A length of 3 mm helps in minimizing the PCB area used while ensuring effective functionality.

Nominal Threshold Voltage (V): +2.93V

The nominal threshold voltage of +2.93V facilitates precise control in power management applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade, this IC is built to perform reliably in a variety of demanding conditions.

Maximum Supply Current (Isup): 0.06 mA

The low maximum supply current of 0.06 mA is beneficial for energy-sensitive applications, reducing overall power consumption.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and stability, optimizing the PCB assembly process.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm offers a balance between ease of soldering and proximity of connections, making it practical for various designs.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC is versatile for applications requiring higher voltage levels without compromising safety.

Technical Specifications

Power Management ICs STM706SDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Width (mm):

3 mm

Trade Compliance

STM706SDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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