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STM706SDS6E

STMicroelectronics

STM706SDS6E by STMicroelectronics

STM706SDS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates in -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,239 parts In-Stock

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4,239

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Vyrian

USA . 2,452 parts In-Stock

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2,452

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Anansix

USA . 892 parts In-Stock

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892

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$8.270

100+ parts

-

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405

$8.270

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IDEA Electronic Components Group

UK . 425 parts In-Stock

1+ parts

$13.725

100+ parts

-

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$12.353

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425

$13.725

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$12.353

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MKK Technologies

India . 2,026 parts In-Stock

1+ parts

$25.810

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2,026

$25.810

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DigiPath Technology Company

USA . 2,026 parts In-Stock

1+ parts

$25.810

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2,026

$25.810

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Microchip USA

USA . 5,883 parts In-Stock

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5,883

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Vigor

Singapore . 5,039 parts In-Stock

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5,039

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Corphita

USA . 4,018 parts In-Stock

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4,018

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Parana Technologies

USA . 412 parts In-Stock

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$16.411

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412

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$16.411

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Overview

Unlock the power of reliable performance with the STM706SDS6E from STMicroelectronics. Designed for efficiency and durability, this advanced Power Management IC ensures your applications run smoothly in even the toughest environments, from industrial to consumer electronics. With its compact design and exceptional temperature range, it delivers unmatched quality that enhances longevity and reduces maintenance costs. Experience superior value and performance tailored for today’s demanding power management needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures protection against environmental factors, enhancing reliability.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern electronic devices.

Package Shape: SQUARE

The square package shape optimizes space on PCBs and supports efficient thermal management.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3V is ideal for a wide range of low-power digital applications.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, making it versatile for various system designs.

No. of Terminals: 8

With 8 terminals, this IC provides ample connectivity options for different circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for high-density applications where space is limited.

Maximum Operating Temperature: 85 °C

Designed to operate at high ambient temperatures, ensuring reliability in industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low temperatures, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for flexible design options and ease of layout on PCBs.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a compact form factor, fitting well in space-constrained designs.

Width: 3 mm

Compact width is ideal for high-density applications, maximizing PCB real estate.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Functions effectively in power supply management, making it essential for energy-efficient designs.

Minimum Supply Voltage (Vsup): 1.2 V

A minimum supply voltage of 1.2V supports low-power operation, suitable for battery-powered applications.

Length: 3 mm

The small length further contributes to its compactness, making it ideal for tight space applications.

Nominal Threshold Voltage (V): +2.93V

A nominal threshold voltage of 2.93V allows the IC to ensure proper operation within specified limits.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature range, promising durability and reliability under tough conditions.

Maximum Supply Current (Isup): 0.06 mA

Extremely low supply current helps in conserving power, making it suitable for energy-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and improves assembly efficiency.

Terminal Pitch: 0.65 mm

A compact terminal pitch allows for a smaller footprint on the PCB, enabling high-density designs.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with a variety of power sources.

Technical Specifications

Power Management ICs STM706SDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Width (mm):

3 mm

Trade Compliance

STM706SDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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