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STM706RDS6F

STMicroelectronics

STM706RDS6F by STMicroelectronics

STM706RDS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,769 parts In-Stock

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3,769

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Digiode

USA . 2,962 parts In-Stock

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2,962

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Anansix

USA . 248 parts In-Stock

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248

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$11.605

100+ parts

$11.489

1k+ parts

$11.025

10k+ parts

-

50

$11.605

$11.489

$11.025

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Microchip USA

USA . 103 parts In-Stock

1+ parts

$14.518

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-

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103

$14.518

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AZTECH Wire

Italy . 1,060 parts In-Stock

1+ parts

$16.470

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1,060

$16.470

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IDEA Electronic Components Group

UK . 1,529 parts In-Stock

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$18.772

100+ parts

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$16.895

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1,529

$18.772

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$16.895

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MKK Technologies

India . 2,231 parts In-Stock

1+ parts

$35.299

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2,231

$35.299

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DigiPath Technology Company

USA . 2,231 parts In-Stock

1+ parts

$35.299

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2,231

$35.299

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Vigor

Singapore . 2,930 parts In-Stock

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2,930

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Corphita

USA . 2,482 parts In-Stock

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2,482

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Parana Technologies

USA . 202 parts In-Stock

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$22.444

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202

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$22.444

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Overview

Elevate your designs with the STM706RDS6F from STMicroelectronics, a trusted leader in innovative power management solutions. This compact IC ensures reliable performance across a wide temperature range, making it perfect for industrial applications. Its robust features enhance energy efficiency and simplify your design process, delivering exceptional value. Choose STM706RDS6F for quality you can trust, ensuring your projects are powered by excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection, making this IC suitable for a variety of applications.

Surface Mount: YES

Surface mount capability enables compact design and ease of integration into modern electronic systems.

Package Shape: SQUARE

The square shape allows for efficient use of PCB space and facilitates better thermal management.

Nominal Supply Voltage (Vsup): 3 V

With a nominal supply voltage of 3V, this IC is ideal for low-power applications, enhancing energy efficiency.

Power Supplies (V): 3/5

Dual supply voltage options (3V/5V) provide versatility, accommodating a range of electronic circuits.

No. of Terminals: 8

The 8-terminal configuration allows for a wide variety of connections, maximizing functionality while minimizing space.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are perfect for space-constrained applications, ensuring a small footprint.

Maximum Operating Temperature: 85 °C

The IC can operate in high-temperature environments, ensuring reliable performance in industrial settings.

Minimum Operating Temperature: -40 °C

With operational limits down to -40 °C, this IC is suitable for harsh environments, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish guarantees excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal position improves layout flexibility, allowing for easier integration into designs.

Maximum Seated Height: 1.1 mm

A low seated height reduces profile, making it easier to fit into compact designs.

Width: 3 mm

The 3 mm width is ideal for densely populated PCBs, facilitating effective integration into small electronic devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit enhances its utility in controlling and regulating power in various applications.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage allows for use in ultra-low power applications, contributing to energy savings.

Length: 3 mm

The compact length further ensures compatibility with tight layouts, providing designers with more flexibility.

Nominal Threshold Voltage (V): +2.63V

A nominal threshold voltage of 2.63V ensures reliable operation in critical voltage-sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies high reliability and stability across a wide range of operating conditions.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of just 0.06 mA highlights the IC's energy efficiency, making it great for battery-powered devices.

Terminal Form: GULL WING

Gull-wing leads enable easy soldering and ensure a robust connection, enhancing overall reliability.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch strikes a good balance between ease of soldering and compact design.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V extends its applicability to various voltage environments and conditions.

Technical Specifications

Power Management ICs STM706RDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Width (mm):

3 mm

Trade Compliance

STM706RDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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