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STM706PDS6E

STMicroelectronics

STM706PDS6E by STMicroelectronics

STM706PDS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,626 parts In-Stock

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7,626

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Digiode

USA . 3,376 parts In-Stock

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3,376

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Anansix

USA . 1,038 parts In-Stock

1+ parts

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1,038

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 550 parts In-Stock

1+ parts

$8.784

100+ parts

-

1k+ parts

$7.906

10k+ parts

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550

$8.784

-

$7.906

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Microchip USA

USA . 435 parts In-Stock

1+ parts

$11.266

100+ parts

-

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435

$11.266

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MKK Technologies

India . 639 parts In-Stock

1+ parts

$16.518

100+ parts

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639

$16.518

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DigiPath Technology Company

USA . 639 parts In-Stock

1+ parts

$16.518

100+ parts

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639

$16.518

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AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$18.120

100+ parts

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801

$18.120

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Component Stockers USA

USA . 373 parts In-Stock

1+ parts

$99.990

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373

$99.990

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Corphita

USA . 2,942 parts In-Stock

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2,942

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Parana Technologies

USA . 1,763 parts In-Stock

1+ parts

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$10.503

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1,763

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$10.503

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Vigor

Singapore . 1,510 parts In-Stock

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1,510

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Overview

Elevate your designs with the STM706PDS6E from STMicroelectronics, a leading name in power management solutions. This compact and reliable IC ensures efficient power delivery across various applications, from industrial to consumer electronics. With exceptional thermal performance and a robust operating range, it enhances product longevity while minimizing energy consumption. Trust STMicroelectronics for unmatched quality and innovation—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability, making it suitable for various applications in power management.

Surface Mount: YES

Surface mount technology allows for efficient assembly and minimizes the circuit board space required, improving overall design flexibility.

Package Shape: SQUARE

A square shape optimizes board layout and facilitates efficient thermal management, enhancing performance.

Nominal Supply Voltage (Vsup): 3 V

With a nominal supply voltage of 3 V, this IC is compatible with common low-power applications, ensuring versatility.

Power Supplies (V): 3/5

Support for both 3 V and 5 V power supplies makes this IC adaptable for a wide range of electronic devices.

No. of Terminals: 8

An 8 terminal configuration provides ample connections while maintaining a compact size, facilitating integration into various circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is designed for space-constrained applications, making it a great choice for portable devices.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes this IC suitable for industrial environments and applications that demand higher temperature resilience.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in extreme conditions, ideal for outdoor or harsh environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances electrical connectivity, improving reliability.

Terminal Position: DUAL

Dual terminal configuration aids in simplifying circuit layout and provides flexible mounting options.

Maximum Seated Height: 1.1 mm

A low seated height contributes to slim profile designs, ideal for modern compact electronic devices.

Width (mm): 3 mm

A width of 3 mm helps optimize space on the PCB, making it a practical choice for densely packed designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is specialized for efficient power handling, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 1.2 V

Minimum supply voltage of 1.2 V expands the IC's usability in low voltage applications, making it suitable for battery-powered devices.

Length: 3 mm

A compact length of 3 mm allows for enhanced layout flexibility in tight spaces, facilitating easier integration.

Nominal Threshold Voltage (V): +2.63V

This threshold voltage is optimal for precise power management, ensuring that the circuit operates efficiently and reliably.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness, making it suitable for long-term deployment in challenging environments.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current ensures power efficiency, extending battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and strength, improving assembly quality in mass production.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch facilitates compatibility with standard PCB designs, simplifying integration into existing systems.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this IC can handle a variety of power sources, adding to its versatility.

Technical Specifications

Power Management ICs STM706PDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Width (mm):

3 mm

Trade Compliance

STM706PDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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