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STM706DS6E

STMicroelectronics

STM706DS6E by STMicroelectronics

STM706DS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages b/w 1.2V and 5.5V. Ideal for industrial applications, it ensures efficient power supply management in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,473 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,473

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Digiode

USA . 2,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,386

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-

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Anansix

USA . 1,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,911

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,025 parts In-Stock

1+ parts

$6.937

100+ parts

-

1k+ parts

$6.243

10k+ parts

-

2,025

$6.937

-

$6.243

-

Microchip USA

USA . 340 parts In-Stock

1+ parts

$8.917

100+ parts

-

1k+ parts

-

10k+ parts

-

340

$8.917

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-

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MKK Technologies

India . 398 parts In-Stock

1+ parts

$13.044

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$13.044

-

-

-

DigiPath Technology Company

USA . 398 parts In-Stock

1+ parts

$13.044

100+ parts

-

1k+ parts

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10k+ parts

-

398

$13.044

-

-

-

AZTECH Wire

Italy . 875 parts In-Stock

1+ parts

$19.460

100+ parts

-

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10k+ parts

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875

$19.460

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-

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Vigor

Singapore . 4,999 parts In-Stock

1+ parts

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4,999

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Corphita

USA . 2,191 parts In-Stock

1+ parts

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2,191

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-

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Parana Technologies

USA . 518 parts In-Stock

1+ parts

-

100+ parts

$8.294

1k+ parts

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10k+ parts

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518

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$8.294

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Overview

Elevate your power management solutions with the STM706DS6E from STMicroelectronics, a leader in innovation and quality. Designed for durability with an extensive temperature range, this versatile IC ensures reliable performance in diverse applications, from industrial automation to consumer electronics. Experience unmatched efficiency and longevity, empowering your projects while enhancing cost-effectiveness and reducing downtime. Choose STM706DS6E for a smart investment in superior technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and resistance to environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient manufacturing processes and saves valuable board space, ideal for compact designs.

Package Shape: SQUARE

The square shape enhances layout options on the PCB, providing flexibility in design and efficient use of space.

Nominal Supply Voltage (Vsup): 5 V

A standard nominal supply voltage of 5V makes it compatible with most power supply designs, simplifying integration.

Power Supplies (V): 1.5/5

Supports dual supply options (1.5V and 5V) to accommodate various circuit requirements and enhance versatility.

No. of Terminals: 8

Having 8 terminals allows for multiple functionalities in a compact form factor, suitable for complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline package design significantly reduces PCB space usage, making it an excellent choice for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is suitable for industrial applications where heat resistance is essential.

Minimum Operating Temperature: -40 °C

Able to operate in extreme cold conditions makes it ideal for outdoor and harsh environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The gold plating ensures excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions enhance stability and make the IC easier to integrate into various PCB layouts.

Maximum Seated Height: 1.1 mm

Its low profile allows for a slim design in PCB assemblies, useful for compact electronics.

Width: 3 mm

A compact 3 mm width is perfect for fitting into tight spaces while still providing full functionality.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power management tasks, this IC excels in efficiency and performance in energy supply applications.

Minimum Supply Voltage (Vsup): 1.2 V

Operating down to 1.2V expands its applicability to low-power devices and battery-operated systems.

Length: 3 mm

The overall dimensions of 3 mm x 3 mm make it an excellent fit for space-constrained designs.

Nominal Threshold Voltage (V): +4.38V

A precise threshold voltage enhances the IC's performance by ensuring accurate power management functionalities.

Temperature Grade: INDUSTRIAL

Rated for industrial use, it guarantees reliability and durability in demanding environments.

Maximum Supply Current (Isup): 0.06 mA

Low supply current indicates energy efficiency, making it eco-friendly and cost-effective in long-term scenarios.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and better mechanical strength, enhancing the IC's assembly quality.

Terminal Pitch: 0.65 mm

A 0.65 mm pitch allows for easy routing and placement on printed circuit boards while maintaining robust connections.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V ensures flexibility in power supply design, accommodating slight variations in supply.

Technical Specifications

Power Management ICs STM706DS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

THRESHOLD VOLTAGE IS 4.38V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Width (mm):

3 mm

Trade Compliance

STM706DS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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