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STM705DS6F

STMicroelectronics

STM705DS6F by STMicroelectronics

STM705DS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,738 parts In-Stock

1+ parts

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7,738

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Digiode

USA . 2,059 parts In-Stock

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2,059

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Anansix

USA . 1,019 parts In-Stock

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1,019

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 389 parts In-Stock

1+ parts

$7.859

100+ parts

-

1k+ parts

$7.073

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389

$7.859

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$7.073

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Microchip USA

USA . 284 parts In-Stock

1+ parts

$10.090

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-

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284

$10.090

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MKK Technologies

India . 701 parts In-Stock

1+ parts

$14.778

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701

$14.778

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DigiPath Technology Company

USA . 701 parts In-Stock

1+ parts

$14.778

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701

$14.778

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AZTECH Wire

Italy . 909 parts In-Stock

1+ parts

$16.880

100+ parts

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909

$16.880

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Component Stockers USA

USA . 623 parts In-Stock

1+ parts

$99.990

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623

$99.990

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Corphita

USA . 4,564 parts In-Stock

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4,564

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Vigor

Singapore . 2,168 parts In-Stock

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2,168

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Parana Technologies

USA . 2,086 parts In-Stock

1+ parts

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$9.396

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2,086

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$9.396

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Overview

Unlock the potential of your designs with the STM705DS6F from STMicroelectronics, a leader in innovation and quality. This power management IC combines exceptional reliability with compact design, ensuring efficient performance across various applications. With a wide supply voltage range and industrial-grade temperature stability, it delivers unmatched value and benefits, making it the ideal choice for your next cutting-edge project. Elevate your solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to various environmental conditions, making this IC reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into modern PCB designs, ensuring space efficiency and reduced manufacturing costs.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, allowing for a compact design and easier assembly.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard in many applications, making this IC versatile for various power management tasks.

Power Supplies (V): 1.5/5

The ability to support both 1.5V and 5V supplies provides flexibility for use in a range of devices and applications.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity for robust functionality while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is designed for high-density applications, allowing for improved performance in confined spaces.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in various environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C makes this IC ideal for harsh and extreme applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the reliability of connections and reduces the risk of corrosion over time.

Terminal Position: DUAL

Dual terminal positioning simplifies layout considerations for easier PCB integration and reduces the risk of misalignment.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm contributes to an ultra-thin profile, ideal for space-constrained applications.

Width: 3 mm

The compact 3 mm width allows for higher component density on PCBs, facilitating smaller designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC efficiently regulates and distributes power, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 1.2 V

The ability to operate at a low minimum supply voltage of 1.2V expands the range of devices that can utilize this IC.

Length: 3 mm

The 3 mm length complements the width for overall compact dimensions, making it suitable for various applications with limited space.

Nominal Threshold Voltage (V): +4.63V

A nominal threshold voltage of +4.63V is advantageous for optimal triggering in power management scenarios.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the IC can withstand harsh operating conditions, ensuring longevity and performance.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of only 0.06 mA, this IC is energy-efficient, making it ideal for battery-powered applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical and electrical performance, facilitating better soldering during assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for fine pitch surface mounting, enhancing PCB layout flexibility.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a safe margin for operation, allowing for stability and reliability under varying loads.

Technical Specifications

Power Management ICs STM705DS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.63V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Width (mm):

3 mm

Trade Compliance

STM705DS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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