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STM705DS6E

STMicroelectronics

STM705DS6E by STMicroelectronics

STM705DS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,786 parts In-Stock

1+ parts

-

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6,786

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Anansix

USA . 1,438 parts In-Stock

1+ parts

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1,438

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Digiode

USA . 849 parts In-Stock

1+ parts

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849

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,525 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$3.500

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AZTECH Wire

Italy . 1,032 parts In-Stock

1+ parts

$11.800

100+ parts

-

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-

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1,032

$11.800

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Microchip USA

USA . 423 parts In-Stock

1+ parts

$16.964

100+ parts

-

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423

$16.964

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IDEA Electronic Components Group

UK . 1,403 parts In-Stock

1+ parts

$19.536

100+ parts

-

1k+ parts

$17.583

10k+ parts

-

1,403

$19.536

-

$17.583

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MKK Technologies

India . 2,351 parts In-Stock

1+ parts

$36.737

100+ parts

-

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10k+ parts

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2,351

$36.737

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DigiPath Technology Company

USA . 2,351 parts In-Stock

1+ parts

$36.737

100+ parts

-

1k+ parts

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2,351

$36.737

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Corphita

USA . 3,531 parts In-Stock

1+ parts

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3,531

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Vigor

Singapore . 2,080 parts In-Stock

1+ parts

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2,080

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Parana Technologies

USA . 798 parts In-Stock

1+ parts

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100+ parts

$23.358

1k+ parts

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798

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$23.358

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Overview

Elevate your designs with the STM705DS6E from STMicroelectronics, a leader in innovative power management solutions. This compact, high-quality IC ensures efficiency and reliability across various industrial applications, from consumer electronics to automation systems. With its robust temperature range and superior build, it guarantees optimal performance under demanding conditions, offering you peace of mind and exceptional value for your projects. Transform your power management strategy today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and reliability of the IC, making it suitable for various applications.

Surface Mount: YES

Surface mounting allows for better space utilization on PCBs and facilitates automated assembly processes.

Package Shape: SQUARE

A square package shape allows for efficient placement on circuit boards, optimizing the layout and potentially saving space.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with many standard digital circuits.

Power Supplies (V): 1.5/5

Versatile power supply range of 1.5V to 5V enables flexibility in design and compatibility with a variety of systems.

No. of Terminals: 8

Eight terminals provide sufficient connectivity for integration into various circuits, ensuring reliable performance.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for compact designs, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable operation in a wide range of environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC can function in extreme conditions, providing robustness in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent solderability and reliability, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning improves ease of connection in PCB designs, facilitating better layout flexibility.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm is advantageous for designs with strict height constraints, contributing to slim profiles.

Width: 3 mm

Compact width allows for efficient use of space on circuit boards, making it ideal for miniaturized devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, it offers functionalities crucial for power efficiency and voltage regulation in varying applications.

Minimum Supply Voltage (Vsup): 1.2 V

The ability to operate down to 1.2 V increases versatility for battery-operated devices, enhancing energy efficiency.

Length: 3 mm

At just 3 mm in length, the IC maintains a compact footprint, making it suitable for space-constrained applications.

Nominal Threshold Voltage (V): +4.63V

A nominal threshold voltage of 4.63V ensures that the IC can effectively manage power delivery in a variety of applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grades guarantee reliable performance under harsh operating conditions, making it ideal for tough environments.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA ensures minimal power consumption, enhancing the efficiency of battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of soldering, facilitating reliable connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density designs, enabling the integration of the IC into smaller electronic spaces.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V broadens the range of applications, making it adaptable to various circuit designs.

Technical Specifications

Power Management ICs STM705DS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.63V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Width (mm):

3 mm

Trade Compliance

STM705DS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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