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STM32MP135FAE7T

STMicroelectronics

STM32MP135FAE7T by STMicroelectronics

STM32MP135FAE7T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It operates at a max clock frequency of 48 MHz, suitable for low power applications like IoT devices due to its min supply voltage of 1.32 V and max operating temperature of 105°C.

Median Price

$6.226

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 12,839 parts In-Stock

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$6.226

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$6.226

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EBV Elektronik

Germany . 35,000 parts In-Stock

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TME

Poland . 35,000 parts In-Stock

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$5.830

35,000

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$5.830

Vyrian

USA . 4,345 parts In-Stock

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Digiode

USA . 1,454 parts In-Stock

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Anansix

USA . 963 parts In-Stock

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Nova Conductors

Japan . 47 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 497 parts In-Stock

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$12.750

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497

$12.750

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Ampacity Inc.

Singapore . 41,776 parts In-Stock

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$18.000

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Corphita

USA . 4,444 parts In-Stock

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Glotronic Ltd.

UK . 1,599 parts In-Stock

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1,599

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32MP135FAE7T by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality microprocessors that offer unparalleled performance and reliability. Ideal for a wide range of applications, this product provides customers with value and benefits that go beyond expectations. Experience seamless integration, high-speed processing, and low power consumption with the STM32MP135FAE7T, setting a new standard in microprocessor technology. Upgrade your projects today and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Integrated cache improves the processor's performance by storing frequently accessed data closer to the CPU for faster retrieval.

Maximum Supply Voltage: 1.38 V

Higher maximum supply voltage provides flexibility in power supply options while ensuring stable operation.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage within the processor itself.

Address Bus Width: 26

Larger address bus width enables the processor to access a larger memory space, improving overall performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards, optimizing layout and design.

Bit Size: 32

32-bit architecture allows for processing larger chunks of data at once, enhancing performance in multitasking environments.

No. of Terminals: 289

Higher number of terminals enables more connectivity options and interfaces for peripheral devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, fine pitch package style offers efficient thermal management and high-density integration on the circuit board.

Minimum Supply Voltage: 1.32 V

Lower minimum supply voltage helps in reducing power consumption and heat generation, prolonging the processor's lifespan.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range ensures reliability and performance in various operating conditions or environments.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for use in extreme cold conditions without impacting performance.

Terminal Position: BOTTOM

Bottom terminal position offers ease of soldering and connection with other components on the circuit board.

Maximum Seated Height: 1.7 mm

Low maximum seated height allows for a slim profile design, suitable for thin and compact electronic devices.

RAM Words: 172032

Large RAM capacity allows for efficient data storage and processing, supporting complex applications and multitasking.

Width: 14 mm

Compact width size enables space-saving integration on circuit boards, suitable for small form factor devices.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the processor during manufacturing and maintenance processes.

External Data Bus Width: 16

Wider external data bus width allows for faster data transfer between the processor and external peripherals.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency enables fast processing speed, making the processor suitable for real-time applications.

Length: 14 mm

Compact length size ensures efficient use of space on circuit boards, especially in constrained design layouts.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the peripheral IC type offers fast and efficient data processing, ideal for high-performance computing applications.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliable performance, making the processor energy-efficient and cost-effective.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and soldering joints, ensuring stable operation of the processor.

Maximum Supply Current: 268 mA

Higher maximum supply current capability supports power-hungry applications and peripherals without compromising performance.

Nominal Supply Voltage: 1.35 V

Stable nominal supply voltage ensures consistent performance and reliability in various operating conditions.

No. of DMA Channels: 56

Large number of DMA channels enable efficient data transfer and management to and from peripherals, enhancing overall system performance.

No. of Serial I/Os: 10

Multiple serial I/Os provide flexibility in connecting to various external devices, expanding the processor's functionality and compatibility.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting on circuit boards, optimizing space utilization and layout design.

Format: FIXED POINT

Fixed-point format ensures accurate numerical calculations without the overhead of floating-point operations, optimizing performance for specific applications.

Speed: 1000 rpm

High-speed performance at 1000 rpm allows for quick data processing and efficient operation in demanding computing tasks.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption during idle or low processing tasks, improving energy efficiency and extending battery life in mobile devices.

Technical Specifications

Microprocessors STM32MP135FAE7T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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