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STM32MP135CAF3T

STMicroelectronics

STM32MP135CAF3T by STMicroelectronics

STM32MP135CAF3T from STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz, supporting low power modes. It features integrated cache and operates within -40 °C to 125 °C. Ideal for embedded applications requiring efficient processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,115 parts In-Stock

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4,115

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Anansix

USA . 1,243 parts In-Stock

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1,243

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Digiode

USA . 672 parts In-Stock

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672

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Distributors (Availability)

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AZTECH Wire

Italy . 1,172 parts In-Stock

1+ parts

$21.040

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1,172

$21.040

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Corphita

USA . 597 parts In-Stock

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597

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Overview

Experience the power of innovation with the STM32MP135CAF3T from STMicroelectronics, a leader in high-performance microprocessors. Designed for versatility, this compact marvel excels in demanding applications like industrial automation, IoT devices, and smart home solutions. Its robust design ensures exceptional reliability and efficient performance, empowering your projects while minimizing energy consumption. Choose STM32MP135CAF3T for unparalleled quality and endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides thermal and electrical insulation, making the microprocessor robust and suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the processing speed and overall performance by allowing quick access to frequently used data.

Surface Mount: YES

Surface mount technology allows for a more compact design, facilitating the integration of the microprocessor into smaller devices.

Maximum Supply Voltage: 1.38 V

A low maximum supply voltage helps in reducing power consumption, which is desirable for energy-efficient devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width is essential for handling data effectively and efficiently, making this microprocessor suitable for various applications.

Address Bus Width: 26

A 26-bit address bus width allows for a larger addressable memory space, enhancing the versatility of the microprocessor.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, making it easier to integrate into different designs.

Bit Size: 32

With a 32-bit architecture, this microprocessor is capable of handling more data at once compared to 16-bit microprocessors, improving performance.

No. of Terminals: 320

A higher number of terminals allows for more connections and functionality, making this microprocessor suitable for complex tasks.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array style allows for effective heat dissipation and a more compact form factor, improving the microprocessor's reliability.

Minimum Supply Voltage: 1.21 V

A low minimum supply voltage further enhances energy efficiency, allowing this microprocessor to operate with lower energy costs.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures indicates robustness, making this microprocessor suitable for harsh environments.

Minimum Operating Temperature: -40 °C

Operating reliably in low temperatures expands potential applications, including those in extreme conditions.

Terminal Position: BOTTOM

Bottom terminal positioning can facilitate better thermal management and space-saving on the PCB.

Maximum Seated Height: 1.2 mm

A low profile height aids in creating thinner devices, ideal for modern compact electronic designs.

RAM Words: 172032

With a substantial number of RAM words available, the microprocessor supports complex computations and multitasking.

Width: 11 mm

The compact width allows for space-efficient designs in PCB layouts.

Boundary Scan: YES

Boundary scan capability enhances testing options, improving reliability and making it easier to debug complex systems.

External Data Bus Width: 16

A 16-bit external data bus width enables efficient communication with other components, increasing overall system performance.

Maximum Clock Frequency: 48 MHz

A higher clock frequency permits faster processing speeds, enhancing the microprocessor's capability to handle demanding tasks.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC microprocessor, it offers a simple instruction set which leads to efficient performance in various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, making it suitable for battery-operated devices.

Terminal Form: BALL

Ball terminals enhance connectivity and offer improved heat dissipation, critical for high-performance applications.

Maximum Supply Current: 239 mA

Relatively low supply current is favorable for energy-efficient devices, allowing it to run longer without recharging.

Nominal Supply Voltage: 1.25 V

Operating at a nominal supply voltage allows for optimal performance while maintaining low energy consumption.

No. of DMA Channels: 56

A high number of DMA channels allows for advanced data handling, reducing CPU load during data transfers.

No. of Serial I/Os: 10

Having multiple serial I/O channels enables versatile communication with various peripherals, enhancing connectivity.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for denser layouts on PCBs, optimizing space for additional functionality.

Format: FIXED POINT

Fixed point format is useful for applications with specific precision requirements, enhancing computational accuracy.

Speed: 650 rpm

Operating at a speed of 650 rpm indicates reliable performance in processing tasks, contributing to efficiency.

Low Power Mode: YES

The presence of a low power mode significantly enhances the microprocessor's energy efficiency, especially in battery-powered applications.

Technical Specifications

Microprocessors STM32MP135CAF3T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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