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STM32MP133DAG7

STMicroelectronics

STM32MP133DAG7 by STMicroelectronics

STM32MP133DAG7 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 105 °C, making it ideal for industrial applications. With low power modes and extensive I/O options, it's perfect for embedded systems.

Median Price

$8.315

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$8.180

100+ parts

$5.280

1k+ parts

$4.690

10k+ parts

$4.550

200

$8.180

$5.280

$4.690

$4.550

DigiKey

USA . 150 parts In-Stock

1+ parts

$8.450

100+ parts

$5.550

1k+ parts

$5.028

10k+ parts

-

150

$8.450

$5.550

$5.028

-

Mouser Electronics

USA . 148 parts In-Stock

1+ parts

$8.450

100+ parts

$5.560

1k+ parts

$5.000

10k+ parts

-

148

$8.450

$5.560

$5.000

-

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$5.280

1k+ parts

$5.140

10k+ parts

-

200

-

$5.280

$5.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 626 parts In-Stock

1+ parts

$7.476

100+ parts

-

1k+ parts

-

10k+ parts

-

626

$7.476

-

-

-

Vyrian

USA . 6,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,795

-

-

-

-

Anansix

USA . 2,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,707

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,761 parts In-Stock

1+ parts

$7.083

100+ parts

-

1k+ parts

-

10k+ parts

-

3,761

$7.083

-

-

-

Overview

Experience the power of innovation with the STM32MP133DAG7 from STMicroelectronics, a leader in microprocessor technology. This robust and efficient microprocessor is designed for versatile applications, delivering exceptional performance while ensuring energy efficiency. Whether you're developing industrial automation, smart home devices, or IoT solutions, its reliability and high-quality manufacturing empower your projects to thrive, offering unparalleled advantages that help you stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight construction, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed by reducing latency for frequently accessed data.

Surface Mount: YES

Surface mount technology allows for smaller design footprints and easier assembly in modern electronics.

Maximum Supply Voltage: 1.38 V

This low maximum supply voltage helps in reducing power consumption, which is ideal for battery-powered devices.

On Chip Data RAM Width: 8

The 8-bit RAM width is effective for applications requiring efficient data handling and processing.

Address Bus Width: 26

A 26-bit address bus width allows access to a larger memory space, enabling complex applications and multitasking.

Package Shape: SQUARE

The square shape aids in optimal space utilization on PCB layouts, enabling compact designs.

Bit Size: 32

A 32-bit architecture supports advanced processing capabilities, making it suitable for modern applications.

No. of Terminals: 289

Having 289 terminals provides extensive connectivity options, facilitating versatility in design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style is designed for high-density applications, ensuring efficient space management and performance.

Minimum Supply Voltage: 1.32 V

The low minimum supply voltage helps optimize power efficiency and prolong the lifespan of portable devices.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures allows this microprocessor to function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this product is suitable for use in extreme conditions, enhancing application versatility.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes the footprint and thermal performance, favoring high-density applications.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a thinner profile, ideal for modern compact devices.

RAM Words: 172032

A high number of RAM words enables efficient data processing and storage, enhancing overall performance.

Width: 9 mm

The compact width allows for space-efficient designs in applications where board real estate is at a premium.

Boundary Scan: YES

Boundary scan capability aids in facilitating testing and debugging, reducing development time and costs.

External Data Bus Width: 16

A 16-bit external data bus width supports effective communication with external devices, increasing system flexibility.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency allows for adequate processing power for a variety of applications.

Length: 9 mm

A compact length enables more integrated designs and saves space on the PCB.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture enhances performance per watt, making it ideal for power-sensitive applications.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher integration, essential for modern devices.

Terminal Form: BALL

Ball terminal form enhances soldering during assembly and improves electrical connections.

Maximum Supply Current: 268 mA

A maximum current rating allows for robust performance while ensuring controlled power consumption.

Nominal Supply Voltage: 1.35 V

A nominal supply voltage helps to ensure stability and reliability in operation, optimizing power efficiency.

No. of DMA Channels: 56

Having 56 DMA channels allows for high-speed data transfers with minimal CPU intervention, enhancing system performance.

No. of Serial I/Os: 10

Ten serial I/Os enhance connectivity options, catering to various peripheral devices for versatile integration.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density mounting while maintaining efficiency in routing.

Format: FIXED POINT

The fixed-point format is efficient for certain applications needing precise and predictable mathematical operations.

Speed: 1000 rpm

Operating speed at 1000 rpm indicates suitability for various dynamic applications, ensuring responsiveness.

Low Power Mode: YES

The inclusion of a low power mode enhances energy efficiency, especially crucial for battery-driven applications.

Technical Specifications

Microprocessors STM32MP133DAG7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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