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STL66DN3LLH5

STMicroelectronics

STL66DN3LLH5 by STMicroelectronics

STL66DN3LLH5 by STMicroelectronics is an N-CHANNEL Power FET with 78.5A max drain current and 72W power dissipation. Ideal for high-power applications, it operates at up to 175°C and features METAL-OXIDE SEMICONDUCTOR technology for efficient performance in surface mount configurations.

Median Price

$0.746

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

1+ parts

$0.566

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

$0.566

-

-

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DigiKey

USA . 1,865 parts In-Stock

1+ parts

$2.480

100+ parts

$1.093

1k+ parts

$0.866

10k+ parts

$0.708

1,865

$2.480

$1.093

$0.866

$0.708

EBV Elektronik

Germany . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

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60,000

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Avnet

USA . 3,000 parts In-Stock

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3,000

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Verical

USA . 3,000 parts In-Stock

1+ parts

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$0.716

3,000

-

-

-

$0.716

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.775

3,000

-

-

-

$0.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,713 parts In-Stock

1+ parts

$1.970

100+ parts

-

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2,713

$1.970

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Chip Stock

USA . 17,900 parts In-Stock

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17,900

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Vyrian

USA . 7,534 parts In-Stock

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7,534

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Anansix

USA . 78 parts In-Stock

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78

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,571 parts In-Stock

1+ parts

$0.660

100+ parts

-

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2,571

$0.660

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IDEA Electronic Components Group

UK . 1,851 parts In-Stock

1+ parts

$1.794

100+ parts

-

1k+ parts

$1.615

10k+ parts

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1,851

$1.794

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$1.615

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Corphita

USA . 557 parts In-Stock

1+ parts

$1.867

100+ parts

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557

$1.867

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.992

100+ parts

$1.813

1k+ parts

$1.633

10k+ parts

-

3,000

$1.992

$1.813

$1.633

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MKK Technologies

India . 405 parts In-Stock

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$3.374

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405

$3.374

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DigiPath Technology Company

USA . 405 parts In-Stock

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$3.374

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405

$3.374

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Microchip USA

USA . 4,389 parts In-Stock

1+ parts

$6.651

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4,389

$6.651

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AZTECH Wire

Italy . 181 parts In-Stock

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$20.310

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181

$20.310

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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22,000

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iodParts Technologies Inc.

India . 8,022 parts In-Stock

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8,022

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Perfect Parts

USA . 4,505 parts In-Stock

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4,505

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 989 parts In-Stock

1+ parts

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$2.145

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989

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$2.145

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Overview

Unleash the power of innovation with the STL66DN3LLH5 by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor boasts unparalleled quality and reliability. Ideal for a wide range of applications, this surface-mount device offers a maximum drain current of 78.5 A and a maximum power dissipation of 72 W, ensuring optimal performance in any scenario. Experience the benefits of cutting-edge METAL-OXIDE SEMICONDUCTOR technology, combined with a maximum operating temperature of 175°C, making it the perfect choice for demanding projects. Elevate your designs with the STL66DN3LLH5 and unlock endless possibilities.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are generally preferred for their higher mobility and lower on-state resistance compared to P-CHANNEL FETs.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and enabling automated assembly processes.

Maximum Drain Current (Abs) (ID): 78.5 A

High maximum drain current capability allows for handling of high power applications effectively.

Maximum Power Dissipation (Abs): 72 W

High power dissipation rating ensures the FET can handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer high input impedance, low output impedance, and faster switching speeds.

Maximum Operating Temperature: 175 °C

Ability to operate at high temperatures helps in maintaining stability and reliability in demanding environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides good solderability and annealing improves the mechanical and thermal stability of the component.

Maximum Time At Peak Reflow Temperature (s): 30

Long duration at peak reflow temperature allows for proper solder reflow and ensures a strong connection.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper melting of the solder paste for a reliable solder joint.

Technical Specifications

Power Field Effect Transistors (FET) STL66DN3LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Maximum Drain Current (Abs) (ID):

78.5 A

Maximum Drain Current (ID):

78.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STL66DN3LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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