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STL65N3LLH5

STMicroelectronics

STL65N3LLH5 by STMicroelectronics

STL65N3LLH5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 65 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact designs with its no-lead surface mount package.

Median Price

$2.520

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 19 parts In-Stock

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$2.520

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19

$2.520

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Distributors (In-Stock)

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Digiode

USA . 1,680 parts In-Stock

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$1.083

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1,680

$1.083

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Vyrian

USA . 2,585 parts In-Stock

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$1.140

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2,585

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Anansix

USA . 2,754 parts In-Stock

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2,754

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ACDS - Activité Composants Distribution Service

France . 470 parts In-Stock

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470

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Bristol Electronics

USA . 470 parts In-Stock

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$1.248

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$0.699

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470

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$1.248

$0.699

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Dan-Mar Components

USA . 470 parts In-Stock

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470

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Microfarads

USA . 193 parts In-Stock

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193

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 542 parts In-Stock

1+ parts

$0.485

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$0.436

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542

$0.485

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$0.436

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MKK Technologies

India . 148 parts In-Stock

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$0.912

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148

$0.912

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DigiPath Technology Company

USA . 148 parts In-Stock

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$0.912

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148

$0.912

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Corphita

USA . 4,796 parts In-Stock

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$1.026

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4,796

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Microchip USA

USA . 8,214 parts In-Stock

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$4.763

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$4.763

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RC Electronics

USA . 40,500 parts In-Stock

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40,500

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Perfect Parts

USA . 18,677 parts In-Stock

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18,677

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Alle Elektronik GmbH

Germany . 3,727 parts In-Stock

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3,727

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 1,837 parts In-Stock

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$0.580

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1,837

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$0.580

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Kepictronics

USA . 413 parts In-Stock

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413

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Overview

Unlock the power of innovation with the STL65N3LLH5 from STMicroelectronics. Renowned for their cutting-edge technology and commitment to quality, STMicroelectronics offers this robust N-channel FET designed for seamless switching applications. With its compact design and high efficiency, you’ll enjoy enhanced performance while saving space on your circuit board. Experience reliability and excellence that empowers your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable packaging, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection and simplifies circuit design by reducing external components.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is ideal for power management and control in electronic circuits.

Surface Mount: YES

Surface mount design facilitates easier integration onto printed circuit boards, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V makes this FET suitable for a wide range of high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient layout options for circuit design, ensuring compact arrangements.

Terminal Form: NO LEAD

No-lead terminals improve reliability and reduce the size of the package, making it a robust solution for modern electronics.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low-power standby modes, improving overall circuit efficiency.

Maximum Pulsed Drain Current (IDM): 76 A

A high pulsed drain current capability of 76A enables the FET to handle high power spikes effectively.

Avalanche Energy Rating (EAS): 180 mJ

High avalanche energy rating indicates robustness against momentary voltage spikes, contributing to circuit reliability.

Maximum Drain Current (Abs) (ID): 65 A

Supports a maximum drain current of 65A, making it suitable for heavy-load applications.

No. of Terminals: 5

With 5 terminals, it provides versatile connection options for various circuit configurations.

Maximum Power Dissipation (Abs): 60 W

60W maximum power dissipation allows for efficient heat management, ensuring stable operation under load.

Package Style (Meter): SMALL OUTLINE

The small outline package style maximizes space efficiency, making it perfect for compact devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high-input impedance and rapid switching capabilities, suitable for high-speed applications.

Maximum Operating Temperature: 150 °C

An operating temperature of 150 °C allows this FET to perform in harsher environments without failure.

Transistor Element Material: SILICON

Silicon as the element material provides good thermal performance and reliability in electrical characteristics.

Maximum Drain Current (ID): 65 A

With a maximum drain current of 65A, it offers robust performance in demanding applications.

Maximum Drain-Source On Resistance: 0.0075 ohm

Very low on-resistance minimizes power losses and increases efficiency during operation.

Terminal Position: DUAL

Dual terminal position enhances installation flexibility in various circuit designs.

Case Connection: DRAIN

DRAIN case connection provides straightforward routing in power electronics applications.

Technical Specifications

Power Field Effect Transistors (FET) STL65N3LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL65N3LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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