Loading...

STL6NM60N

STMicroelectronics

STL6NM60N by STMicroelectronics

STL6NM60N by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 23A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,608

-

-

-

-

Anansix

USA . 2,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,481

-

-

-

-

Digiode

USA . 1,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

-

-

-

-

R&J Components

USA . 151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

151

-

-

-

-

Bristol Electronics

USA . 81 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

81

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,318 parts In-Stock

1+ parts

$1.063

100+ parts

-

1k+ parts

$0.956

10k+ parts

-

2,318

$1.063

-

$0.956

-

MKK Technologies

India . 1,638 parts In-Stock

1+ parts

$1.998

100+ parts

-

1k+ parts

-

10k+ parts

-

1,638

$1.998

-

-

-

DigiPath Technology Company

USA . 1,638 parts In-Stock

1+ parts

$1.998

100+ parts

-

1k+ parts

-

10k+ parts

-

1,638

$1.998

-

-

-

AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$17.790

100+ parts

-

1k+ parts

-

10k+ parts

-

798

$17.790

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,704

-

-

-

-

Kepictronics

USA . 6,099 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,099

-

-

-

-

Alle Elektronik GmbH

Germany . 4,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,517

-

-

-

-

Corphita

USA . 2,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,968

-

-

-

-

Parana Technologies

USA . 2,207 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

-

10k+ parts

-

2,207

-

$1.270

-

-

Overview

Elevate your power management solutions with the STL6NM60N from STMicroelectronics, a leader in semiconductor innovation. This high-quality N-channel FET combines superior switching capabilities with exceptional reliability, making it ideal for diverse applications ranging from industrial automation to consumer electronics. Benefit from its compact design and robust performance, ensuring your projects achieve maximum efficiency without compromising on quality. Choose STL6NM60N for unmatched value and performance that drives your success.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are generally favored for their higher electron mobility, allowing for better performance in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and provides reverse voltage protection, ensuring reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast response times and efficient operation.

Surface Mount: YES

Surface mount capability allows for reduced PCB space and easier automated assembly, enhancing manufacturing efficiency.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage rating makes this FET suitable for high-voltage applications, ensuring robustness.

Package Shape: SQUARE

The square package shape provides efficient heat dissipation and compatibility with various PCB designs.

Terminal Form: NO LEAD

No lead design minimizes footprint and provides additional flexibility in circuit layout and space management.

Operating Mode: ENHANCEMENT MODE

Enhancement mode ensures low power consumption when the device is off, improving energy efficiency.

Maximum Pulsed Drain Current (IDM): 23 A

A high pulsed drain current capability allows the FET to handle transient loads effectively, making it versatile in various applications.

Avalanche Energy Rating (EAS): 65 mJ

The avalanche energy rating protects the device from damage during voltage spikes, increasing reliability.

Maximum Drain Current (Abs) (ID): 5.7 A

The maximum drain current ensures that the FET can handle significant loads in demanding applications.

No. of Terminals: 12

Having multiple terminals allows for more flexibility in circuit connections and enhances the device's options in circuit designs.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation rating indicates the FET can manage substantial power levels, crucial for power management applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging reduces thermal resistance and facilitates better heat management in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for lower gate drive power and the possibility of integration with other circuits, enhancing design flexibility.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures stability and performance even in demanding environments.

Transistor Element Material: SILICON

Silicon as a material provides good thermal and electrical properties, making it suitable for high-performance applications.

Maximum Drain Current (ID): 1 A

While the continuous drain current is lower, it allows for precise control in low-power applications, making it adaptable.

Maximum Drain-Source On Resistance: 0.92 ohm

Low on-resistance results in less power loss and increased efficiency during operation, enhancing overall performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on PCBs and provides design flexibility for various applications.

Case Connection: DRAIN

Direct connection to the drain simplifies circuit design and enhances the device's performance in practical applications.

Technical Specifications

Power Field Effect Transistors (FET) STL6NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

5.7 A

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

.92 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XQCC-N12

No. of Elements:

1

No. of Terminals:

12

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

23 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL6NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17