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STGWA30H65FB

STMicroelectronics

STGWA30H65FB by STMicroelectronics

STGWA30H65FB from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2V, supports up to 60A collector current, and operates in temperatures ranging from -55 °C to 175 °C. Ideal for high-performance switching tasks, it ensures reliable operation with minimal losses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,051 parts In-Stock

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4,051

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Digiode

USA . 2,319 parts In-Stock

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2,319

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Anansix

USA . 1,368 parts In-Stock

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1,368

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 104 parts In-Stock

1+ parts

$0.298

100+ parts

-

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$0.268

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104

$0.298

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$0.268

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MKK Technologies

India . 930 parts In-Stock

1+ parts

$0.561

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930

$0.561

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DigiPath Technology Company

USA . 930 parts In-Stock

1+ parts

$0.561

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930

$0.561

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AZTECH Wire

Italy . 1,137 parts In-Stock

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$10.660

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1,137

$10.660

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Perfect Parts

USA . 3,394 parts In-Stock

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3,394

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Corphita

USA . 1,837 parts In-Stock

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1,837

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Parana Technologies

USA . 1,084 parts In-Stock

1+ parts

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$0.356

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1,084

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$0.356

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Overview

Unlock exceptional performance with the STGWA30H65FB from STMicroelectronics, a leader in power management technology. This robust Insulated Gate Bipolar Transistor (IGBT) is engineered for efficiency and reliability, making it ideal for demanding power control applications. With its superior thermal stability and high voltage capabilities, you can trust this component to enhance your designs while reducing energy consumption and ensuring longevity. Experience the difference with STMicroelectronics' commitment to innovation and quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide higher efficiency and better performance in switching applications, making them preferable for power control.

Configuration: SINGLE

A single configuration simplifies the design, making it easier to integrate into power control systems.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT delivers high performance in regulating power supply.

Maximum VCEsat: 2 V

Low VCEsat reduces power losses during operation, enhancing efficiency in power management applications.

Package Shape: RECTANGULAR

The rectangular package shape optimally utilizes space on circuit boards, allowing for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical and electrical connections, ensuring reliability in long-term use.

Nominal Turn Off Time (toff): 223 ns

A fast turn-off time allows for quicker response in power control circuits, improving overall system efficiency.

No. of Terminals: 3

Three terminals facilitate easier connections while maintaining a compact footprint.

Maximum Power Dissipation (Abs): 260 W

A high power dissipation rating means this IGBT can handle substantial power loads, making it reliable for heavy-duty applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide excellent heat dissipation, essential for high-power applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for operation in extreme environments without risking damage.

Maximum Collector-Emitter Voltage: 650 V

A high voltage rating makes this IGBT suitable for high-voltage applications, enhancing its versatility.

Transistor Element Material: SILICON

Silicon material ensures good electrical performance and thermal stability.

Maximum Gate-Emitter Voltage: 20 V

A higher gate-emitter voltage range provides more flexibility in circuit design and operation.

Minimum Operating Temperature: -55 °C

Wide temperature operating range (-55 °C to 175 °C) makes this IGBT suitable for diverse application environments.

Maximum Collector Current (IC): 60 A

High collector current capacity supports demanding applications, allowing for effective power management.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate threshold voltage aids in controlling the IGBT effectively while preventing unnecessary power losses.

Terminal Position: SINGLE

Single terminal positioning streamlines design, making it easier to work with in circuit layouts.

Nominal Turn On Time (ton): 51.1 ns

Fast turn-on time enhances switching speed, crucial in applications requiring rapid control of power.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA30H65FB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

223 ns

Nominal Turn On Time (ton):

51.1 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWA30H65FB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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