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STGWA30H60DFB

STMicroelectronics

STGWA30H60DFB by STMicroelectronics

STGWA30H60DFB from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2V, supports up to 600V collector-emitter voltage, and operates at temperatures from -55 °C to 175 °C. Ideal for high-performance applications, it ensures reliable operation with a built-in diode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,903 parts In-Stock

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5,903

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Digiode

USA . 1,711 parts In-Stock

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1,711

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Anansix

USA . 971 parts In-Stock

1+ parts

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971

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,032 parts In-Stock

1+ parts

$1.034

100+ parts

-

1k+ parts

$0.931

10k+ parts

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1,032

$1.034

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$0.931

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MKK Technologies

India . 521 parts In-Stock

1+ parts

$1.945

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521

$1.945

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DigiPath Technology Company

USA . 521 parts In-Stock

1+ parts

$1.945

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521

$1.945

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$15.130

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490

$15.130

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Corphita

USA . 2,134 parts In-Stock

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2,134

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Parana Technologies

USA . 588 parts In-Stock

1+ parts

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$1.236

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588

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$1.236

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Overview

Unlock unparalleled performance with the STGWA30H60DFB from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel IGBT is designed for exceptional power control, elevating your applications with remarkable efficiency and reliability. Whether you're in automotive, industrial, or renewable energy sectors, this robust device delivers superior thermal management and rapid switching capabilities, ensuring optimal operation in even the most demanding environments. Experience the quality and innovation that STMicroelectronics brings to your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight design and effective protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel design offers better electron mobility, leading to higher performance in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies circuit design by integrating a diode, resulting in reduced component count and improved reliability.

Transistor Application: POWER CONTROL

Specifically designed for power control, this IGBT is suitable for a variety of high-power applications.

Maximum VCEsat: 2 V

A low saturation voltage means reduced power losses and improved efficiency during operation.

Package Shape: RECTANGULAR

Rectangular packaging enhances space efficiency on PCBs, allowing for more compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical stability and ease of soldering, making assembly simpler.

Nominal Turn Off Time (toff): 223 ns

A quick turn-off time enables efficient switching capabilities, essential for high-frequency applications.

No. of Terminals: 3

Three terminals provide straightforward connections for easy integration into existing circuits.

Maximum Power Dissipation (Abs): 260 W

High power dissipation capability makes this device suitable for demanding applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount allows for robust installation options, contributing to effective thermal management.

Maximum Operating Temperature: 175 °C

A high operating temperature rating ensures reliability in extreme conditions and prolonged lifespan.

Maximum Collector-Emitter Voltage: 600 V

A high voltage rating makes this IGBT suitable for a wide range of industrial and power applications.

Transistor Element Material: SILICON

Silicon as the base material provides excellent semiconductor properties, allowing efficient operation.

Maximum Gate-Emitter Voltage: 20 V

A generous gate-emitter voltage allows versatility in driving circuits, accommodating various control voltages.

Minimum Operating Temperature: -55 °C

An extensive temperature range ensures reliable performance in extreme environmental conditions.

Maximum Collector Current (IC): 60 A

High collector current rating is ideal for significant power handling, expanding application versatility.

Maximum Gate-Emitter Threshold Voltage: 7 V

The threshold voltage allows for easy drive from standard logic levels, simplifying control circuit design.

Terminal Position: SINGLE

Single terminal position aids in straightforward mounting and wiring, facilitating effective design and assembly.

Case Connection: COLLECTOR

Direct collector connection enhances efficiency and simplifies power distribution within a circuit.

Nominal Turn On Time (ton): 51.1 ns

Fast turn-on time supports high-frequency switching applications, improving overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA30H60DFB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

223 ns

Nominal Turn On Time (ton):

51.1 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWA30H60DFB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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