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STGWA25S120DF3

STMicroelectronics

STGWA25S120DF3 by STMicroelectronics

STGWA25S120DF3 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.1V, supports up to 375W power dissipation, and operates at temperatures from -55 °C to 175 °C. Ideal for high-voltage applications with a max collector-emitter voltage of 1200V.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Digiode

USA . 3,931 parts In-Stock

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Anansix

USA . 2,647 parts In-Stock

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Vyrian

USA . 2,475 parts In-Stock

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2,475

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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Bristol Electronics

USA . 60 parts In-Stock

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Dan-Mar Components

USA . 60 parts In-Stock

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IDEA Electronic Components Group

UK . 600 parts In-Stock

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$0.578

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$0.520

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600

$0.578

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$0.520

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MKK Technologies

India . 308 parts In-Stock

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$1.086

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DigiPath Technology Company

USA . 308 parts In-Stock

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$1.086

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AZTECH Wire

Italy . 1,011 parts In-Stock

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$19.440

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Component Stockers USA

USA . 699 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 18,751 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Parana Technologies

USA . 2,152 parts In-Stock

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$0.691

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Corphita

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Perfect Parts

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Overview

Experience the power of innovation with the STGWA25S120DF3 IGBT from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This robust N-channel transistor excels in power control applications, delivering superior efficiency and reliability—perfect for industries ranging from renewable energy to industrial automation. With its impressive thermal performance and fast switching times, elevate your designs while enjoying unmatched quality and support from a trusted manufacturer. Choose STMicroelectronics for a brighter, more efficient future!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration usually provides better electron mobility, leading to higher efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode allows for simpler circuit designs while enhancing protection against reverse voltage.

Transistor Application: POWER CONTROL

Tailored for power control applications, it's suitable for high-performance systems requiring efficient energy management.

Maximum VCEsat: 2.1 V

A low VCEsat value indicates lower conduction losses, enhancing the efficiency of the overall system.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient layout design on PCBs, optimizing space usage.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide stable mechanical support and are particularly advantageous in high-power applications.

Nominal Turn Off Time (toff): 593 ns

Fast turn-off time contributes to better switching performance, which is critical in high-frequency applications.

No. of Terminals: 3

Three terminals facilitate easy integration into various circuit designs while ensuring reliable connectivity.

Maximum Power Dissipation (Abs): 375 W

A high power dissipation rating allows this IGBT to handle significant power loads, contributing to its reliability in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers improved heat dissipation and facilitates mounting on heatsinks or other cooling solutions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature enhances its performance in rugged environments, allowing for a wider range of applications.

Maximum Collector-Emitter Voltage: 1200 V

With a high voltage rating, this IGBT can be used in high-voltage applications, expanding its usability in diverse systems.

Transistor Element Material: SILICON

Silicon element material is a standard for its stable performance and reliability in semiconductor devices.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for compatibility with a variety of drive circuits, improving versatility.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature ensures proper function even in extreme cold environments, making it suitable for aerospace and automotive applications.

Maximum Collector Current (IC): 50 A

A collector current rating of 50 A makes it ideal for applications requiring substantial current handling capacity.

Maximum Gate-Emitter Threshold Voltage: 7 V

The gate-emitter threshold voltage allows for efficient switching operation and prevents accidental turn-on, enhancing circuit safety.

Terminal Position: SINGLE

Having a single terminal position simplifies integration and layout designs, making it user-friendly.

Case Connection: COLLECTOR

The case connection to the collector ensures effective electrical performance and simplifies power connections.

Nominal Turn On Time (ton): 43 ns

A very short turn-on time improves overall switching speed, making it ideal for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA25S120DF3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

593 ns

Nominal Turn On Time (ton):

43 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGWA25S120DF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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