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STGW30N90D

STMicroelectronics

STGW30N90D by STMicroelectronics

STGW30N90D from STMicroelectronics is an N-channel IGBT ideal for power control applications. It features a max collector-emitter voltage of 900 V, a power dissipation of 220 W, and operates at up to 150 °C. Its fast switching times (ton: 41 ns, toff: 928 ns) enhance efficiency in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,733 parts In-Stock

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Anansix

USA . 621 parts In-Stock

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621

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Lakeland Logistics Inc

USA . 600 parts In-Stock

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600

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Bristol Electronics

USA . 600 parts In-Stock

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600

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Digiode

USA . 353 parts In-Stock

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353

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,144 parts In-Stock

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$0.855

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$0.769

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2,144

$0.855

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$0.769

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MKK Technologies

India . 556 parts In-Stock

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$1.607

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556

$1.607

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DigiPath Technology Company

USA . 556 parts In-Stock

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$1.607

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556

$1.607

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AZTECH Wire

Italy . 1,110 parts In-Stock

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$10.220

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1,110

$10.220

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A-Z Elektronik GmbH

Germany . 5,553 parts In-Stock

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5,553

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,997 parts In-Stock

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1,997

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Parana Technologies

USA . 1,908 parts In-Stock

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$1.022

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$1.022

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Perfect Parts

USA . 354 parts In-Stock

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354

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Overview

Unlock superior power control with the STGW30N90D IGBT from STMicroelectronics. Renowned for its exceptional quality and reliability, this N-channel transistor is designed to excel in demanding applications, delivering efficiency and performance you can trust. With advanced thermal management and compact design, it seamlessly integrates into your projects, enhancing energy savings and device longevity. Elevate your designs today with a partner committed to innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer lower on-state resistance and better performance in power applications, enhancing efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves performance in applications requiring freewheeling capabilities.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for high efficiency in switching applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on PCBs, facilitating compact design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and robust connections in high-power applications, ensuring reliability.

Nominal Turn Off Time (toff): 928 ns

A relatively quick turn-off time allows for efficient switching, minimizing losses and enabling higher operational frequencies.

No. of Terminals: 3

The three-terminal design simplifies circuitry and allows for straightforward integration into various configurations.

Maximum Power Dissipation (Abs): 220 W

High power dissipation capability ensures that the IGBT can handle demanding applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides robust heat dissipation and mechanical support, critical for high-power applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature enhances reliability under thermal stress, making it suitable for challenging environments.

Maximum Collector-Emitter Voltage: 900 V

High voltage capability allows the IGBT to be used in applications that require handling substantial voltage levels.

Transistor Element Material: SILICON

Silicon-based construction provides good performance characteristics and thermal stability, making it a reliable choice.

Maximum Gate-Emitter Voltage: 25 V

A gate-emitter voltage limit of 25 V ensures compatibility with standard gate drive circuits while maintaining adequate control.

Maximum Collector Current (IC): 60 A

A high collector current rating makes this IGBT suitable for applications requiring substantial current handling without degradation.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A lower threshold voltage enhances responsiveness, allowing faster switching and improved overall performance.

Nominal Turn On Time (ton): 41 ns

A short turn-on time enables efficient switching and less energy loss during operation, ideal for high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW30N90D attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

900 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

928 ns

Nominal Turn On Time (ton):

41 ns

Trade Compliance

STGW30N90D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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