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STGW28IH125DF

STMicroelectronics

STGW28IH125DF by STMicroelectronics

STGW28IH125DF from STMicroelectronics is a robust N-channel IGBT ideal for high-power applications. It features a max VCEsat of 2.5V, 375W power dissipation, and operates up to 175 °C. Perfect for industrial drives and renewable energy systems.

Median Price

$4.520

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 560 parts In-Stock

1+ parts

$4.200

100+ parts

$2.070

1k+ parts

$1.630

10k+ parts

-

560

$4.200

$2.070

$1.630

-

Chip1Stop

Japan . 486 parts In-Stock

1+ parts

$4.520

100+ parts

$1.890

1k+ parts

-

10k+ parts

-

486

$4.520

$1.890

-

-

Arrow

USA . 526 parts In-Stock

1+ parts

$4.533

100+ parts

$3.599

1k+ parts

$3.449

10k+ parts

-

526

$4.533

$3.599

$3.449

-

Avnet

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

-

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1,680

-

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-

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Verical

USA . 464 parts In-Stock

1+ parts

-

100+ parts

-

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464

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,119 parts In-Stock

1+ parts

$3.116

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$3.116

-

-

-

TME

Poland . 60 parts In-Stock

1+ parts

$4.100

100+ parts

$2.930

1k+ parts

-

10k+ parts

-

60

$4.100

$2.930

-

-

Vyrian

USA . 5,448 parts In-Stock

1+ parts

-

100+ parts

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5,448

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-

-

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Anansix

USA . 865 parts In-Stock

1+ parts

-

100+ parts

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865

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 518 parts In-Stock

1+ parts

$0.638

100+ parts

-

1k+ parts

$0.575

10k+ parts

-

518

$0.638

-

$0.575

-

MKK Technologies

India . 2,218 parts In-Stock

1+ parts

$1.201

100+ parts

-

1k+ parts

-

10k+ parts

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2,218

$1.201

-

-

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DigiPath Technology Company

USA . 2,218 parts In-Stock

1+ parts

$1.201

100+ parts

-

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10k+ parts

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2,218

$1.201

-

-

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Corphita

USA . 2,398 parts In-Stock

1+ parts

$2.952

100+ parts

-

1k+ parts

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10k+ parts

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2,398

$2.952

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Microchip USA

USA . 3,729 parts In-Stock

1+ parts

$18.794

100+ parts

-

1k+ parts

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10k+ parts

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3,729

$18.794

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-

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A-Z Elektronik GmbH

Germany . 4,716 parts In-Stock

1+ parts

-

100+ parts

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4,716

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

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2,800

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RC Electronics

USA . 1,803 parts In-Stock

1+ parts

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1,803

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Parana Technologies

USA . 1,242 parts In-Stock

1+ parts

-

100+ parts

$0.763

1k+ parts

-

10k+ parts

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1,242

-

$0.763

-

-

Overview

Elevate your power management solutions with the STGW28IH125DF from STMicroelectronics, a leader in innovative semiconductor technologies. This N-channel IGBT combines robustness and efficiency to ensure optimal performance in demanding applications like industrial drives and renewable energy systems. With superior thermal stability and quick response times, it guarantees reliability and reduced energy costs, empowering you to push boundaries while maximizing system performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures good insulation properties and protects the internal components, making the product robust and reliable in various environmental conditions.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration provides high electron mobility, allowing for improved efficiency and faster switching speeds in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a single configuration with a built-in diode simplifies circuit design and adds the benefit of enhanced performance in both switching and rectification applications.

Maximum VCEsat: 2.5 V

A low VCEsat value indicates lower conduction losses during operation, contributing to improved overall efficiency in power conversion applications.

Package Shape: RECTANGULAR

The rectangular shape of the package facilitates efficient space utilization on PCBs, making it easier to integrate into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide superior mechanical strength and reliability in connections, particularly in high-current applications.

Nominal Turn Off Time (toff): 322 ns

A fast turn off time enhances the performance in high-frequency applications, allowing for quicker response in switching operations.

No. of Terminals: 3

The three-terminal design is standard for IGBTs, ensuring ease of integration and compatibility with existing circuit designs.

Maximum Power Dissipation (Abs): 375 W

A high power dissipation capability allows the component to handle substantial loads, ensuring reliability under high-performance conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide better thermal management and mechanical stability, making them suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this IGBT can function effectively in demanding thermal environments, enhancing its reliability in industrial applications.

Maximum Collector-Emitter Voltage: 1250 V

A high maximum collector-emitter voltage allows for the implementation in high-voltage applications, increasing versatility across different electronic designs.

Transistor Element Material: SILICON

Silicon as the material for the transistor element offers proven performance characteristics, stability, and widespread acceptance in the industry.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V enables flexible control over the IGBT, allowing designers to optimize gate drive circuits effectively.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures reliable performance in extreme cold environments, making it suitable for aerospace and automotive applications.

Maximum Collector Current (IC): 60 A

A maximum collector current of 60 A allows for heavy load handling, providing the capability to drive significant power in various applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate gate-emitter threshold voltage offers a good balance, ensuring the device can turn on effectively while avoiding sensitivity to noise.

Terminal Position: SINGLE

Having a single terminal position aids in simplifying layout designs, improving space efficiency on printed circuit boards.

Case Connection: COLLECTOR

The collector case connection facilitates effective heat dissipation, critical for sustaining high performance and longevity in power systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW28IH125DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1250 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

322 ns

Maximum VCEsat:

2.5 V

Trade Compliance

STGW28IH125DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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