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STGW25S120DF3

STMicroelectronics

STGW25S120DF3 by STMicroelectronics

STGW25S120DF3 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2.1V, supports up to 375W power dissipation, and operates at temperatures from -55 °C to 175 °C. Ideal for high-voltage systems with a max collector-emitter voltage of 1200V.

Median Price

$8.360

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 25 parts In-Stock

1+ parts

$8.360

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25

$8.360

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,207 parts In-Stock

1+ parts

$9.338

100+ parts

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2,207

$9.338

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Vyrian

USA . 6,346 parts In-Stock

1+ parts

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6,346

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Anansix

USA . 623 parts In-Stock

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623

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,105 parts In-Stock

1+ parts

$1.228

100+ parts

-

1k+ parts

$1.105

10k+ parts

-

1,105

$1.228

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$1.105

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MKK Technologies

India . 274 parts In-Stock

1+ parts

$2.310

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274

$2.310

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DigiPath Technology Company

USA . 274 parts In-Stock

1+ parts

$2.310

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274

$2.310

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Corphita

USA . 997 parts In-Stock

1+ parts

$8.847

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997

$8.847

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Microchip USA

USA . 174 parts In-Stock

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$25.424

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174

$25.424

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Component Stockers USA

USA . 619 parts In-Stock

1+ parts

$99.990

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619

$99.990

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Parana Technologies

USA . 1,790 parts In-Stock

1+ parts

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$1.468

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1,790

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$1.468

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Overview

Elevate your power control solutions with the STGW25S120DF3 IGBT from STMicroelectronics, a leader in innovation and reliability. This robust N-channel transistor offers outstanding efficiency and thermal performance, making it perfect for industrial applications like motor drives and renewable energy systems. Enjoy peace of mind knowing you’re backed by ST’s commitment to quality, empowering your designs with superior performance and longevity. Unlock new possibilities with ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances reliability and provides excellent moisture resistance, making the IGBT suitable for challenging environments.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for higher efficiency and superior performance in power electronics, making them ideal for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode allows for easier integration and improved efficiency in power control circuits.

Transistor Application: POWER CONTROL

Designed for power control applications, this IGBT can handle high voltage and current, making it suitable for a wide range of industrial uses.

Maximum VCEsat: 2.1 V

A low VCEsat value indicates reduced power loss during operation, enhancing overall system efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for compact designs and easy mounting in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical stability and ease of soldering in a variety of PCB layouts.

Nominal Turn Off Time (toff): 593 ns

A fast turn-off time contributes to improved switching performance, allowing for more efficient operation in high-frequency applications.

No. of Terminals: 3

The three terminal design simplifies connections and integration into various circuits, enhancing versatility.

Maximum Power Dissipation (Abs): 375 W

A high maximum power dissipation rating allows the IGBT to handle large amounts of power without overheating, enhancing reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure attachment in assemblies, providing effective heat management and stability.

Maximum Operating Temperature: 175 C

A high maximum operating temperature allows for use in demanding environments, increasing the range of applications.

Maximum Collector-Emitter Voltage: 1200 V

This high voltage rating makes it suitable for use in high-voltage applications, ensuring robust performance.

Transistor Element Material: SILICON

Silicon provides excellent thermal stability and electrical properties, making the IGBT reliable and efficient.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage provides flexibility in control, allowing for efficient operation in various circuit designs.

Minimum Operating Temperature: -55 C

The ability to operate at extremely low temperatures expands the IGBT's usability in harsh environments.

Maximum Collector Current (IC): 50 A

This high collector current capability ensures the IGBT can handle significant load demands, making it suitable for power-intensive applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A relatively low threshold voltage ensures adequate gate drive from common power supply levels, simplifying circuit design.

Terminal Position: SINGLE

Single terminal position allows for straightforward circuit layouts and simplifies design processes.

Case Connection: COLLECTOR

The collector case connection design aids in power distribution and enhances thermal management during operation.

Nominal Turn On Time (ton): 43 ns

A short turn-on time allows for fast switching capabilities, supporting high-frequency applications with improved efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW25S120DF3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

593 ns

Nominal Turn On Time (ton):

43 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGW25S120DF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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