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STF25NM60N

STMicroelectronics

STF25NM60N by STMicroelectronics

STF25NM60N by STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 21A max drain current, and built-in diode for enhanced performance. Ideal for high-voltage power management systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,859 parts In-Stock

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Anansix

USA . 2,164 parts In-Stock

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Digiode

USA . 354 parts In-Stock

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354

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IDEA Electronic Components Group

UK . 716 parts In-Stock

1+ parts

$1.834

100+ parts

-

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$1.651

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716

$1.834

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$1.651

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MKK Technologies

India . 284 parts In-Stock

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$3.450

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284

$3.450

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DigiPath Technology Company

USA . 284 parts In-Stock

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$3.450

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284

$3.450

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AZTECH Wire

Italy . 294 parts In-Stock

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$15.810

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$15.810

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A-Z Elektronik GmbH

Germany . 4,641 parts In-Stock

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4,641

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Alle Elektronik GmbH

Germany . 4,355 parts In-Stock

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RC Electronics

USA . 3,701 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 626 parts In-Stock

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Parana Technologies

USA . 307 parts In-Stock

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$2.193

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$2.193

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Kepictronics

USA . 92 parts In-Stock

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Perfect Parts

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Overview

Elevate your projects with the STF25NM60N from STMicroelectronics, a powerhouse in power FET technology. Renowned for its exceptional quality and reliability, this N-channel transistor ensures efficient switching performance in various applications, such as industrial automation and renewable energy systems. With robust features and impressive endurance, it offers unparalleled value, helping you achieve superior results while maximizing efficiency in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance characteristics and higher efficiency, making them ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies the design and enhances protection against reverse voltage, making it reliable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers fast response times, which is critical for efficient circuit operation.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle significant voltage levels, safeguarding circuits against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical connections, ensuring stability in high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables lower power consumption and higher efficiency, essential for modern electronic devices.

Maximum Pulsed Drain Current (IDM): 84 A

High pulsed drain current capacity allows this FET to handle substantial load without damage, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 850 mJ

A high avalanche energy rating provides additional protection against transients and ensures reliability during operation.

No. of Terminals: 3

The 3-terminal configuration streamlines circuit design and reduces complexity.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure attachment to heat sinks, improving thermal management in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide-semiconductor technology provides high input impedance and fast switching speeds, making this FET highly efficient.

Transistor Element Material: SILICON

Silicon-based FETs are well-established and offer great performance in a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and prevents oxidation, ensuring longevity and reliability.

Maximum Drain Current (ID): 21 A

An ample maximum drain current rating supports robust performance in demanding applications.

Maximum Drain-Source On Resistance: 0.16 ohm

Low on-resistance contributes to reduced power losses and improved efficiency in power management.

Terminal Position: SINGLE

A single terminal position facilitates easier integration into circuit designs and reduces layout complexity.

Case Connection: ISOLATED

An isolated case connection provides safety benefits by preventing electrical interference and ensuring reliability during operation.

Technical Specifications

Power Field Effect Transistors (FET) STF25NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF25NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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