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STF20NM60D

STMicroelectronics

STF20NM60D by STMicroelectronics

STF20NM60D by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 80A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,040 parts In-Stock

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4,040

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Digiode

USA . 3,894 parts In-Stock

1+ parts

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3,894

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ComSIT Distribution GmbH

Germany . 675 parts In-Stock

1+ parts

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675

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Anansix

USA . 141 parts In-Stock

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141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,363 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

$1.413

10k+ parts

-

1,363

$1.570

-

$1.413

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MKK Technologies

India . 72 parts In-Stock

1+ parts

$2.951

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72

$2.951

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DigiPath Technology Company

USA . 72 parts In-Stock

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$2.951

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72

$2.951

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AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$16.030

100+ parts

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338

$16.030

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Alle Elektronik GmbH

Germany . 4,720 parts In-Stock

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4,720

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Corphita

USA . 2,606 parts In-Stock

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2,606

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Parana Technologies

USA . 2,060 parts In-Stock

1+ parts

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100+ parts

$1.877

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2,060

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$1.877

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Kepictronics

USA . 99 parts In-Stock

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99

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Overview

Unlock the power of efficiency with the STF20NM60D from STMicroelectronics, a leader in innovation and reliability. This N-channel Power FET is engineered for superior switching performance, making it ideal for demanding applications like home appliances, industrial automation, and renewable energy systems. Experience unmatched quality and durability that enhance your designs while optimizing energy consumption. Elevate your projects with a trusted component that empowers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials provide good insulation and protection against environmental factors, enhancing the reliability of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower on-resistance and higher electron mobility, making them efficient for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow, providing additional protection and functionality in circuit designs.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle rapid on-and-off cycles, making it suitable for power management and control.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures the transistor can operate safely under higher voltages, enhancing versatility in various applications.

Package Shape: RECTANGULAR

Rectangular packaging can facilitate efficient heat dissipation and easy integration into PCB layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, making the FET suitable for more rugged applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control and efficiency in conducting states, making it ideal for low-power applications.

Maximum Pulsed Drain Current (IDM): 80 A

High pulsed drain current capability supports applications requiring brief high power bursts, ensuring flexibility in power delivery.

Avalanche Energy Rating (EAS): 700 mJ

A solid avalanche rating indicates the FET can withstand energy spikes, enhancing reliability in transient conditions.

Maximum Drain Current (Abs) (ID): 20 A

The maximum drain current rating allows effective performance in various power applications, ensuring operational efficiency.

No. of Terminals: 3

Three terminals simplify circuit design and integration while maintaining necessary functionality.

Maximum Power Dissipation (Abs): 45 W

A power dissipation rating of 45W indicates the ability to handle substantial power, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides additional mechanical stability, making it ideal for applications where physical robustness is crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for faster switching speeds and lower power loss, which is critical for modern electronic systems.

Maximum Operating Temperature: 150 °C

A high operating temperature rating increases reliability in demanding environments and applications.

Transistor Element Material: SILICON

Silicon-based transistors are well-established in the industry, offering good performance and thermal stability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-lasting electrical performance.

Maximum Drain Current (ID): 20 A

The consistent maximum drain current rating supports effective management of current loads in various use cases.

Maximum Drain-Source On Resistance: 0.29 ohm

Low on-resistance leads to improved efficiency and reduced heat generation during operation, beneficial for power applications.

Terminal Position: SINGLE

Single terminal position simplifies the design process and enhances layout flexibility in circuit designs.

Case Connection: ISOLATED

Isolated case connections improve safety and functionality by preventing unwanted current paths within the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STF20NM60D attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.29 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF20NM60D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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