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STE36N50-DK

STMicroelectronics

STE36N50-DK by STMicroelectronics

STE36N50-DK by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 36A max drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,705 parts In-Stock

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2,705

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Anansix

USA . 1,486 parts In-Stock

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1,486

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Vyrian

USA . 1,440 parts In-Stock

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1,440

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 750 parts In-Stock

1+ parts

$0.339

100+ parts

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1k+ parts

$0.306

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750

$0.339

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$0.306

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MKK Technologies

India . 333 parts In-Stock

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$0.638

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333

$0.638

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DigiPath Technology Company

USA . 333 parts In-Stock

1+ parts

$0.638

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333

$0.638

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Parana Technologies

USA . 2,223 parts In-Stock

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$0.406

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2,223

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$0.406

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Corphita

USA . 2,021 parts In-Stock

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2,021

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Overview

Unlock the power of efficiency with the STE36N50-DK from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-Channel Power FET is designed for seamless switching applications, ensuring reliability and durability even under demanding conditions. Experience reduced energy loss and enhanced thermal management, making it ideal for industrial automation, power supplies, and renewable energy systems. Trust in STMicroelectronics' commitment to quality and innovation, and elevate your projects with superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good reliability and cost-effectiveness, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and are generally preferred for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the device's versatility and protects against reverse current.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can handle rapid on-off operations effectively.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage, ensuring reliability in high-voltage applications.

Package Shape: RECTANGULAR

A rectangular shape allows for easier integration into various circuit layouts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides higher efficiency and better control in switching applications.

Maximum Pulsed Drain Current (IDM): 144 A

The ability to handle high pulsed currents ensures suitability for demanding applications.

Avalanche Energy Rating (EAS): 100 mJ

A high avalanche energy rating provides extra protection for transient events, improving reliability.

No. of Terminals: 4

Four terminals offer flexibility in circuit design, allowing for various configurations and connections.

Package Style (Meter): FLANGE MOUNT

Flange mount style facilitates easy installation and improved thermal management in the application.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers higher input impedance and lower power consumption.

Maximum Operating Temperature: 150 °C

High operating temperature capability allows the FET to function reliably in demanding environments.

Transistor Element Material: SILICON

Silicon provides excellent conductivity and thermal stability, making it suitable for high-performance devices.

Maximum Drain Current (ID): 36 A

Capability to handle substantial continuous current, making it ideal for power management applications.

Maximum Drain-Source On Resistance: 0.14 ohm

Low on-resistance results in better power efficiency and reduced heat generation during operation.

Terminal Position: UPPER

Upper terminal positioning can simplify PCB layout and improve accessibility for connections.

Case Connection: ISOLATED

Isolated case connection prevents electrical interference, enhancing device stability and performance.

Reference Standard: UL RECOGNIZED

Compliance with UL standards ensures a high level of safety and reliability for end-user applications.

Technical Specifications

Power Field Effect Transistors (FET) STE36N50-DK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

144 A

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE36N50-DK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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