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STE38NB50F

STMicroelectronics

STE38NB50F by STMicroelectronics

STE38NB50F by STMicroelectronics is a robust N-channel FET designed for switching applications, featuring a 500V breakdown voltage and 38A max drain current. It offers high efficiency with a low on-resistance of 0.14Ω and can handle up to 400W power dissipation. Ideal for industrial power management, it operates effectively at temperatures up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,540 parts In-Stock

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2,540

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Vyrian

USA . 1,539 parts In-Stock

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1,539

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Digiode

USA . 1,071 parts In-Stock

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1,071

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 554 parts In-Stock

1+ parts

$1.737

100+ parts

-

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$1.563

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554

$1.737

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$1.563

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MKK Technologies

India . 793 parts In-Stock

1+ parts

$3.266

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793

$3.266

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DigiPath Technology Company

USA . 793 parts In-Stock

1+ parts

$3.266

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793

$3.266

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Corphita

USA . 3,263 parts In-Stock

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3,263

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Kepictronics

USA . 553 parts In-Stock

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553

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Parana Technologies

USA . 242 parts In-Stock

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$2.077

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242

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$2.077

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Overview

Unlock the power of efficiency with the STE38NB50F from STMicroelectronics, a leader in innovation and reliability. This N-channel power FET delivers exceptional performance for switching applications, ensuring your systems run smoothly under high demands. With built-in diode and robust ratings, it’s designed to withstand tough conditions, making it perfect for industrial and automotive markets. Trust STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers good durability and thermal stability, making the FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance in terms of conductivity and switching speed, which enhances the efficiency of circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode protects the circuit from back EMF, ensuring longevity and reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in rapidly turning on and off, optimizing power control.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage provides robust performance in high-voltage applications, ensuring safety and reliability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on a PCB, aiding in compact design.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures low on-resistance and high efficiency, which is crucial for power conservation.

Maximum Pulsed Drain Current (IDM): 152 A

With a high pulsed drain current capability, this FET can handle significant load surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1200 mJ

A high avalanche energy rating ensures that the FET can withstand transient conditions, enhancing reliability in fluctuating environments.

Maximum Drain Current (Abs) (ID): 38 A

The ability to handle high continuous drain currents makes this FET a strong candidate for high-power applications.

No. of Terminals: 4

The four-terminal design allows for effective circuit integration and simplifies connections, leading to easier implementation.

Maximum Power Dissipation (Abs): 400 W

A high power dissipation rating ensures that the FET can operate efficiently without overheating in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides secure mechanical stability, which is essential for reliable operation in various environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology, this FET offers high speed and low power consumption, desirable qualities in modern electronic circuits.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures allows this FET to function in harsher conditions, enhancing its versatility.

Transistor Element Material: SILICON

Silicon provides excellent thermal conductivity and is the most widely used semiconductor material, ensuring reliability and performance.

Terminal Finish: NICKEL

Nickel terminal finish provides good resistance to corrosion and enhances the longevity of the connections.

Maximum Drain Current (ID): 38 A

Consistent maximum drain current rating ensures robust performance across a range of applications, particularly in power management.

Maximum Drain-Source On Resistance: 0.14 ohm

A low on-resistance minimizes power losses during operation, creating an efficient power transfer within the system.

Terminal Position: UPPER

Upper terminal positioning allows for flexibility in circuit layout, supporting various design architectures.

Case Connection: ISOLATED

Isolated case connections eliminate the risk of short circuits and enhance the safety and reliability of the device in operation.

Technical Specifications

Power Field Effect Transistors (FET) STE38NB50F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

1200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

152 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

NICKEL

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE38NB50F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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