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STD95N04T4

STMicroelectronics

STD95N04T4 by STMicroelectronics

STD95N04T4 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for power management in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,758 parts In-Stock

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2,758

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Vyrian

USA . 2,380 parts In-Stock

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2,380

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Digiode

USA . 1,644 parts In-Stock

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1,644

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,342 parts In-Stock

1+ parts

$1.823

100+ parts

-

1k+ parts

$1.641

10k+ parts

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2,342

$1.823

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$1.641

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MKK Technologies

India . 1,387 parts In-Stock

1+ parts

$3.429

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1,387

$3.429

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DigiPath Technology Company

USA . 1,387 parts In-Stock

1+ parts

$3.429

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1,387

$3.429

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Corphita

USA . 3,387 parts In-Stock

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3,387

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Parana Technologies

USA . 812 parts In-Stock

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$2.180

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812

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$2.180

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Overview

Unlock unparalleled performance with the STD95N04T4 from STMicroelectronics, a leader in innovative power solutions. This N-channel FET is designed for efficient switching applications, delivering exceptional reliability and robust performance even in demanding environments. With its compact footprint and built-in diode, it saves space while maximizing power handling. Elevate your designs with this high-quality transistor, ensuring reduced energy consumption and increased system efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high electron mobility, leading to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the FET's efficiency by providing protection against reverse polarity, which is crucial in many circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can efficiently control power in circuits, making it ideal for power management.

Surface Mount: YES

Being surface mount allows for a compact design and easier integration into modern circuit boards, optimizing space and reducing size.

Minimum DS Breakdown Voltage: 40 V

A high breakdown voltage ensures reliability under high voltage conditions, making the product suitable for various high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it easier to design compact and efficient electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides stable mounting and ease of soldering, which enhances manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for lower power consumption and better control over the transistor's operation, improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current rating gives the transistor the ability to handle large current surges, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 80 A

The ability to sustain up to 80 A of continuous drain current makes this FET suitable for high-power applications without overheating.

No. of Terminals: 2

With only 2 terminals, this device simplifies circuit design and reduces the complexity associated with multi-terminal configurations.

Maximum Power Dissipation (Abs): 110 W

The capability to dissipate 110 W of power ensures thermal management in high-power applications, reducing the risk of damage from overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for denser PCB layouts, catering to the needs of modern electronic devices that require miniaturization.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances performance by providing high input impedance and low power consumption, making these FETs power-efficient.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature indicates the FET's ability to operate in harsh environments, providing versatility in use.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and efficiency in transistors, ensuring consistent performance.

Maximum Drain Current (ID): 80 A

The maximum drain current of 80 A allows for a robust performance in power applications, ensuring stable operation under load.

Maximum Drain-Source On Resistance: 0.0065 ohm

A low on-resistance minimizes power losses during operation, enhancing efficiency and reducing heat generation in the circuit.

Terminal Position: SINGLE

Having a single terminal position simplifies the PCB layout and reduces design complexity, making it easier to integrate into circuits.

Case Connection: DRAIN

The drain connection provides efficient control over the flow of current, optimizing the transistor's switching capabilities.

Technical Specifications

Power Field Effect Transistors (FET) STD95N04T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD95N04T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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