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STD90N03L-1

STMicroelectronics

STD90N03L-1 by STMicroelectronics

STD90N03L-1 by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a max drain current of 80 A and a breakdown voltage of 30 V. It offers low on-resistance at 0.0057 Ω and operates up to 175 °C. This versatile FET is packaged in a through-hole design for easy integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,793 parts In-Stock

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Anansix

USA . 1,117 parts In-Stock

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Digiode

USA . 461 parts In-Stock

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461

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

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$0.741

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$0.667

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MKK Technologies

India . 1,310 parts In-Stock

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$1.393

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DigiPath Technology Company

USA . 1,310 parts In-Stock

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$1.393

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$1.393

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AZTECH Wire

Italy . 1,211 parts In-Stock

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$18.910

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$18.910

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Kepictronics

USA . 8,026 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,926 parts In-Stock

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Corphita

USA . 4,807 parts In-Stock

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Parana Technologies

USA . 659 parts In-Stock

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$0.886

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Overview

Unlock unparalleled performance with the STD90N03L-1 from STMicroelectronics, a leader in innovative semiconductor solutions. This powerful N-channel FET excels in efficiency and reliability, perfect for a wide range of applications from automotive to industrial switching. With its robust design and minimal on-resistance, you can trust it to enhance your systems while delivering exceptional value, ultimately driving your projects to success. Experience the difference quality makes!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package ensures reliability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and have higher electron mobility, which leads to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the FET, allowing for easier integration in circuits and reducing component count.

Transistor Application: SWITCHING

Designed for efficient switching, this FET is ideal for applications requiring fast and reliable on/off control of electrical power.

Minimum DS Breakdown Voltage: 30 V

This minimum breakdown voltage allows for safe operation in medium-voltage applications without risking damage from voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape assists in effective heat dissipation and provides a compact design, suitable for space-constrained devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and robust mechanical support, making it easy to solder onto printed circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode increases the efficiency of the FET by minimizing leakage currents and improving performance in low-power applications.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current allows the FET to handle significant transient loads, ideal for applications with high current requirements.

Avalanche Energy Rating (EAS): 350 mJ

A higher avalanche energy rating means the FET can withstand greater energy surges, providing reliability under stress conditions.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum drain current of 80 A, this FET is suitable for high-power applications without overheating or failing.

No. of Terminals: 3

The three-terminal configuration is straightforward to integrate into a variety of circuit designs, simplifying the layout process.

Maximum Power Dissipation (Abs): 95 W

A maximum power dissipation of 95 W allows the FET to operate efficiently under heavy loads without damaging components.

Package Style (Meter): IN-LINE

The in-line package style facilitates easier mounting and layout in PCB designs, making it efficient for both prototyping and production.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Being a MOSFET, this transistor provides low on-resistance and high-speed switching capabilities, enhancing overall circuit performance.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows for use in demanding environments, expanding the range of potential applications.

Transistor Element Material: SILICON

Silicon is a widely used material known for its excellent electrical characteristics and reliability in various electronic applications.

Maximum Drain Current (ID): 80 A

The maximum drain current rating of 80 A allows for flexibility in high-current applications without the risk of thermal failure.

Maximum Drain-Source On Resistance: 0.0057 ohm

The low on-resistance indicates minimal power loss during operation, improving overall efficiency and reducing thermal buildup.

Terminal Position: SINGLE

A single terminal position makes the device easy to integrate into standard circuit designs while providing stability.

Case Connection: DRAIN

Having the case connection to the drain simplifies connection in designs and provides a better path for heat dissipation.

Technical Specifications

Power Field Effect Transistors (FET) STD90N03L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD90N03L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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