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STD95N2LH5TRL

STMicroelectronics

STD95N2LH5TRL by STMicroelectronics

STD95N2LH5TRL by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 25 V, and operates at up to 175 °C. Ideal for high-performance power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,471 parts In-Stock

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4,471

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Anansix

USA . 2,821 parts In-Stock

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2,821

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Vyrian

USA . 2,641 parts In-Stock

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2,641

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

1+ parts

$0.567

100+ parts

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$0.510

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1,745

$0.567

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$0.510

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MKK Technologies

India . 1,609 parts In-Stock

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$1.066

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1,609

$1.066

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DigiPath Technology Company

USA . 1,609 parts In-Stock

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$1.066

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1,609

$1.066

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Corphita

USA . 2,882 parts In-Stock

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2,882

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Parana Technologies

USA . 1,233 parts In-Stock

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$0.678

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1,233

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$0.678

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Overview

Unlock unparalleled efficiency with the STD95N2LH5TRL from STMicroelectronics, your go-to solution for advanced power management. Designed with innovation in mind, this N-Channel FET excels in switching applications, offering exceptional performance and reliability. With STMicroelectronics' commitment to quality, users benefit from superior thermal stability and robust operation in challenging environments. Elevate your designs and ensure longevity while enjoying peace of mind with a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers robustness and durability, making the transistor suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance and efficiency, making them ideal for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy implementation in circuits that require both switching and protection against back EMF.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in rapidly turning on and off, ensuring efficient performance.

Surface Mount: YES

Surface mount technology (SMT) facilitates compact designs and allows for automated manufacturing processes.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25 V ensures reliable operation in various electrical environments without failure.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on PCBs, making it suitable for high-density applications.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of soldering, contributing to reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the channel, resulting in lower power consumption during operation.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability of 320 A enables the transistor to handle demanding load requirements during transient events.

Avalanche Energy Rating (EAS): 165 mJ

The rated avalanche energy provides protection against voltage spikes, enhancing the device's reliability in various applications.

No. of Terminals: 2

With only 2 terminals, this FET simplifies circuit design and minimizes space requirements, making it ideal for compact applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces board space usage, allowing for more components to be integrated into a design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high-speed switching and low on-resistance, improving overall efficiency in electronic circuits.

Maximum Operating Temperature: 175 °C

A high operating temperature rating indicates the FET's reliability and performance in demanding thermal environments.

Transistor Element Material: SILICON

Silicon is the most common semiconductor material, providing excellent electrical characteristics and thermal stability.

Maximum Drain Current (ID): 80 A

With a maximum drain current of 80 A, the transistor can handle significant loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.006 ohm

A very low on-resistance minimizes power loss during operation, leading to greater efficiency and reduced heating.

Terminal Position: SINGLE

A single terminal position simplifies connections and layout design, making integration easier for engineers.

Case Connection: DRAIN

Having the drain as the case connection ensures efficient heat dissipation and enhances the overall thermal management of the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STD95N2LH5TRL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

165 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD95N2LH5TRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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