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STD60N3LH5

STMicroelectronics

STD60N3LH5 by STMicroelectronics

STD60N3LH5 by STMicroelectronics is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 48A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 192A Pulsed Drain Current, and 0.0114 ohm On Resistance. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 60W and can withstand temperatures up to 175°C.

Median Price

$0.172

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$0.172

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$0.172

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Vyrian

USA . 5,490 parts In-Stock

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5,490

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Digiode

USA . 2,245 parts In-Stock

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2,245

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Anansix

USA . 1,075 parts In-Stock

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1,075

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Goldney Electronics S.L.

Spain . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,652 parts In-Stock

1+ parts

$0.172

100+ parts

-

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$0.169

5,652

$0.172

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-

$0.169

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.172

100+ parts

$0.169

1k+ parts

$0.163

10k+ parts

$0.160

2,000

$0.172

$0.169

$0.163

$0.160

Argo Parts USA

USA . 1,948 parts In-Stock

1+ parts

$0.172

100+ parts

-

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-

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$0.167

1,948

$0.172

-

-

$0.167

Corohmni

South Africa . 1,210 parts In-Stock

1+ parts

$0.339

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1,210

$0.339

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Ampacity Inc.

Singapore . 754 parts In-Stock

1+ parts

$1.050

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754

$1.050

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IDEA Electronic Components Group

UK . 378 parts In-Stock

1+ parts

$1.108

100+ parts

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$0.997

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378

$1.108

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$0.997

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Aztec Data Supply Inc.

USA . 1,451 parts In-Stock

1+ parts

$1.518

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1,451

$1.518

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MKK Technologies

India . 1,189 parts In-Stock

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$2.083

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1,189

$2.083

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DigiPath Technology Company

USA . 1,189 parts In-Stock

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$2.083

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1,189

$2.083

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AZTECH Wire

Italy . 727 parts In-Stock

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$13.007

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727

$13.007

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RC Electronics

USA . 64,919 parts In-Stock

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Lixinc

USA . 8,830 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,435 parts In-Stock

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4,435

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Corphita

USA . 4,179 parts In-Stock

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4,179

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Parana Technologies

USA . 1,260 parts In-Stock

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$1.324

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1,260

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$1.324

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 819 parts In-Stock

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819

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Authorized Procurement Solutions

USA . 80 parts In-Stock

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80

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Overview

Unlock the power of efficient switching with the STD60N3LH5 by STMicroelectronics. Crafted with precision by a trusted manufacturer, this N-channel Power FET offers unparalleled quality and reliability. Ideal for a variety of applications, this transistor provides enhanced performance and durability. Experience the benefits of its single configuration with built-in diode, delivering maximum pulsing drain current and minimal power dissipation. Elevate your projects with the STD60N3LH5 and enjoy seamless operation and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance in switching applications, making it a reliable choice for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space, making it convenient for compact electronic devices.

Transistor Application: SWITCHING

Ensures fast and efficient switching operation, ideal for applications requiring rapid response times.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, enhancing the overall reliability and performance of the device.

Minimum DS Breakdown Voltage: 30 V

Provides a sufficient safety margin for voltage spikes, increasing the reliability of the transistor in various operating conditions.

Package Shape: RECTANGULAR

Offers a compact form factor that facilitates easy integration into circuit designs with limited space.

Terminal Form: GULL WING

Provides a reliable connection to the circuit board, ensuring stable operation even in challenging environments.

Operating Mode: ENHANCEMENT MODE

Enables precise control over the switching characteristics, enhancing the overall efficiency of the device.

Maximum Pulsed Drain Current (IDM): 192 A

Allows for high peak current handling capability, making it suitable for demanding applications with sudden power surges.

Avalanche Energy Rating (EAS): 160 mJ

Provides a high level of energy absorption capacity, enhancing the ruggedness and reliability of the transistor.

Maximum Drain Current (Abs) (ID): 48 A

Offers a high continuous current rating, making it suitable for applications requiring sustained power delivery.

No. of Terminals: 2

Simplifies the connection layout and reduces assembly complexity, making it user-friendly for circuit designers.

Maximum Power Dissipation (Abs): 60 W

Enables the transistor to dissipate heat efficiently, contributing to long-term reliability in high-power applications.

Package Style (Meter): SMALL OUTLINE

Provides a compact package size, ideal for space-constrained designs in various electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers high performance and reliability, ensuring consistent operation in demanding environments.

Maximum Operating Temperature: 175 °C

Allows for operation in high-temperature environments, expanding the range of applications where the transistor can be used.

Transistor Element Material: SILICON

Offers excellent electrical properties and reliability, ensuring consistent performance over an extended operational lifespan.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a durable and corrosion-resistant finish, ensuring long-term electrical connections and reliability.

Maximum Drain Current (ID): 48 A

Provides a high current handling capability, making it suitable for various power management applications.

Maximum Drain-Source On Resistance: 0.0114 ohm

Provides low on-resistance for efficient power handling, reducing power losses and improving overall efficiency.

Terminal Position: SINGLE

Simplifies the connection process and reduces assembly complexity, making it user-friendly for circuit integration.

Case Connection: DRAIN

Facilitates easy integration into circuit designs, providing a simple connection point for efficient power management.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly, contributing to the reliability and longevity of the transistor.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes during assembly, ensuring the integrity of the solder joints for long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) STD60N3LH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

160 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

48 A

Maximum Drain Current (ID):

48 A

Maximum Drain-Source On Resistance:

.0114 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD60N3LH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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