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STD60N55-1

STMicroelectronics

STD60N55-1 by STMicroelectronics

STD60N55-1 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 65 A, a breakdown voltage of 55 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 1,248 parts In-Stock

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Vyrian

USA . 420 parts In-Stock

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420

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Digiode

USA . 345 parts In-Stock

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345

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IDEA Electronic Components Group

UK . 2,301 parts In-Stock

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$0.309

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$0.278

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2,301

$0.309

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MKK Technologies

India . 201 parts In-Stock

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$0.581

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$0.581

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DigiPath Technology Company

USA . 201 parts In-Stock

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$0.581

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201

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Corphita

USA . 1,731 parts In-Stock

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Parana Technologies

USA . 104 parts In-Stock

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$0.370

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$0.370

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Overview

Unlock the power of efficiency with the STD60N55-1 from STMicroelectronics, a leader in semiconductor innovation. This N-channel Power FET offers exceptional performance for switching applications, ensuring reliability and longevity in your designs. With its robust construction and superior thermal management, it delivers unparalleled value for high-demand environments. Elevate your projects and witness enhanced energy savings while benefiting from STMicroelectronics' commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance for switching applications, allowing for faster operation and efficiency in circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and provides added versatility, especially in switching applications where protection against back EMF is crucial.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high-speed operations effectively, making it ideal for power management systems.

Minimum DS Breakdown Voltage: 55 V

A minimum drain-source breakdown voltage of 55 V provides a reliable margin of safety in high-voltage applications, enhancing overall circuit reliability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and space utilization, facilitating easier integration into various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical connections, making it suitable for applications that require strong solder joints and reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and increased efficiency, ideal for modern electronic applications.

Maximum Pulsed Drain Current (IDM): 260 A

The ability to handle pulsed currents up to 260 A ensures that this FET can manage transient loads effectively, crucial for high-power applications.

Avalanche Energy Rating (EAS): 390 mJ

A high avalanche energy rating indicates that this transistor can withstand voltage spikes, enhancing reliability in protective circuits.

Maximum Drain Current (Abs) (ID): 65 A

With a maximum drain current of 65 A, this FET can handle significant loads, making it suitable for high-current applications.

No. of Terminals: 3

A 3-terminal configuration simplifies integration into circuits, providing a straightforward design for various applications.

Maximum Power Dissipation (Abs): 110 W

The high power dissipation capability of 110 W allows the FET to operate efficiently under load without overheating, ensuring durability.

Package Style (Meter): IN-LINE

The in-line package style is ideal for automated assembly and improves space efficiency on PCBs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOSFET technology allows for high input impedance, lower power loss, and improved switching speeds, making this a versatile component.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature of 175 °C allows this FET to perform reliably in demanding environments.

Transistor Element Material: SILICON

Silicon as the transistor element material ensures good electrical properties, stability, and performance across a wide temperature range.

Terminal Finish: TIN

Tin finishing offers good conductivity and corrosion resistance, ensuring long-term reliability in electronic applications.

Maximum Drain Current (ID): 65 A

Reiterating the 65 A maximum drain current emphasizes its capability to support heavy loads, reinforcing its application in power systems.

Maximum Drain-Source On Resistance: 0.0105 ohm

A low on-resistance of 0.0105 ohms minimizes energy losses during operation, enhancing overall system efficiency.

Terminal Position: SINGLE

The single terminal position allows for easier mounting and connection in compact space designs.

Case Connection: DRAIN

Direct drain connection facilitates efficient heat dissipation and enhanced overall performance in power applications.

Technical Specifications

Power Field Effect Transistors (FET) STD60N55-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

390 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

260 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD60N55-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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