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STB25NM60N-1

STMicroelectronics

STB25NM60N-1 by STMicroelectronics

STB25NM60N-1 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 21A max drain current, and built-in diode for enhanced performance. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,137 parts In-Stock

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3,137

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Digiode

USA . 758 parts In-Stock

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758

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Anansix

USA . 556 parts In-Stock

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556

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Inventory MP

USA . 470 parts In-Stock

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470

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Bristol Electronics

USA . 470 parts In-Stock

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470

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IDEA Electronic Components Group

UK . 1,783 parts In-Stock

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$1.196

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$1.076

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$1.076

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MKK Technologies

India . 1,610 parts In-Stock

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$2.249

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$2.249

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DigiPath Technology Company

USA . 1,610 parts In-Stock

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$2.249

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1,610

$2.249

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AZTECH Wire

Italy . 730 parts In-Stock

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$21.190

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730

$21.190

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A-Z Elektronik GmbH

Germany . 6,615 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,478 parts In-Stock

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Corphita

USA . 4,369 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,030 parts In-Stock

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$1.430

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$1.430

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Overview

Elevate your projects with the STB25NM60N-1 from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel Power FET guarantees exceptional performance and reliability for your switching applications, thanks to its robust design and quality manufacturing. With impressive voltage handling and built-in diode protection, it ensures efficient operation while reducing energy loss, making it the perfect choice for industrial, automotive, and consumer electronics. Experience the power of precision engineering and enhance your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental stress, making the FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

As an N-channel FET, this transistor provides higher efficiency and better performance in switching applications, which is essential for modern electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against reverse polarity and enhances reliability in switching applications, making it more user-friendly.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures rapid response times and low power losses, essential for high-performance electronic systems.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows the FET to operate safely in high-voltage environments, making it a versatile choice for various power management applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and facilitates easy integration into printed circuit boards (PCBs), enhancing design flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are well-suited for applications requiring strong connections and higher power handling.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for lower off-state current and better efficiency, which is beneficial in reducing total power consumption in circuits.

Maximum Pulsed Drain Current (IDM): 84 A

This high pulsed drain current capability enables the FET to handle transient load conditions effectively, making it ideal for applications with surge requirements.

Avalanche Energy Rating (EAS): 850 mJ

The high avalanche energy rating indicates good robustness against catastrophic failures, adding reliability and peace of mind in power applications.

No. of Terminals: 3

A 3-terminal configuration simplifies circuit design and integration, making it easier to implement in various electronic applications.

Package Style (Meter): IN-LINE

The in-line package style enhances thermal management and aids in proper layout during PCB design, improving performance yet again.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low power losses, contributing to overall energy efficiency in electronic devices.

Transistor Element Material: SILICON

Silicon as the transistor element material ensures high efficiency and compatibility with a wide range of applications, making it a staple in the industry.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and resistance to oxidation, ensuring durable and reliable electrical connections over time.

Maximum Drain Current (ID): 21 A

The ability to handle a maximum drain current of 21 A makes this FET suitable for high-power applications, enhancing its versatility.

Maximum Drain-Source On Resistance: 0.16 ohm

A low on-resistance reduces voltage drop and heat generation, which is crucial for improving efficiency in power circuits and prolonging device life.

Terminal Position: SINGLE

The single terminal position allows for easy and straightforward routing on PCBs, which can save time and resources during the design and assembly phases.

Technical Specifications

Power Field Effect Transistors (FET) STB25NM60N-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB25NM60N-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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