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STB23NM60N

STMicroelectronics

STB23NM60N by STMicroelectronics

STB23NM60N by STMicroelectronics is a powerful N-channel MOSFET designed for efficient switching applications. It features a 600V breakdown voltage, 19A max drain current, and operates at up to 150 °C. Ideal for high-performance power management in compact designs.

Median Price

$5.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mobius Materials

USA . 70 parts In-Stock

1+ parts

$5.950

100+ parts

$4.790

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70

$5.950

$4.790

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Vyrian

USA . 6,543 parts In-Stock

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6,543

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Digiode

USA . 4,271 parts In-Stock

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4,271

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Netsource Technology, Inc.

USA . 4,000 parts In-Stock

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4,000

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Anansix

USA . 1,963 parts In-Stock

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1,963

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LIBRA Elektronik GmbH

Germany . 15 parts In-Stock

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15

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

1+ parts

$0.585

100+ parts

-

1k+ parts

$0.527

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-

2,005

$0.585

-

$0.527

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MKK Technologies

India . 831 parts In-Stock

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$1.100

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831

$1.100

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DigiPath Technology Company

USA . 831 parts In-Stock

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$1.100

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831

$1.100

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AZTECH Wire

Italy . 315 parts In-Stock

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$19.350

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315

$19.350

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Kepictronics

USA . 7,652 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,775 parts In-Stock

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Corphita

USA . 4,316 parts In-Stock

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RC Electronics

USA . 3,333 parts In-Stock

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3,333

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Alle Elektronik GmbH

Germany . 1,884 parts In-Stock

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1,884

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Parana Technologies

USA . 880 parts In-Stock

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$0.700

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880

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$0.700

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Overview

Unlock superior performance with the STB23NM60N from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET is designed for seamless switching applications, delivering exceptional reliability and efficiency. With its compact package and built-in diode, it simplifies integration while ensuring outstanding thermal management. Elevate your projects with a component that embodies quality and innovation, making it ideal for various demanding applications in industrial and consumer electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection against environmental factors, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance characteristics, such as lower on-resistance, making them suitable for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse voltage, making it ideal for switching applications where reverse current flow may occur.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast operation, making it suitable for a wide range of electronic devices.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs and facilitates automated assembly processes.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage makes this FET robust for use in high-voltage applications, providing reliability and safety.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for efficient board layout, optimizing space usage in electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide good solderability and mechanical strength, ensuring stable connections in applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the transistor remains off until a certain gate voltage is applied, providing excellent control over the switching behavior.

Maximum Pulsed Drain Current (IDM): 76 A

A high pulsed drain current rating allows for better handling of transient conditions, making the FET suitable for dynamic applications.

Avalanche Energy Rating (EAS): 700 mJ

The significant avalanche energy capability enhances the overall robustness of the device, allowing it to withstand unexpected surges.

Maximum Drain Current (Abs) (ID): 19 A

The high absolute maximum drain current rating indicates that this FET can handle substantial loads, making it reliable for demanding applications.

No. of Terminals: 2

The simplicity of a two-terminal design makes the FET easy to integrate and use in various circuit configurations.

Maximum Power Dissipation (Abs): 150 W

A high power dissipation rating allows this FET to handle significant energy loads without overheating, ensuring longevity and reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes board space usage, making it ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching speeds, making this FET suitable for a wide range of applications in modern electronics.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures makes this device suitable for harsh environments and demanding applications.

Transistor Element Material: SILICON

Silicon is a widely used material in semiconductor devices, providing reliable and consistent performance in various applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and resistance to oxidation, ensuring reliable electrical connections over time.

Maximum Drain Current (ID): 19 A

This consistent current rating enables predictable performance in various applications, providing design stability.

Maximum Drain-Source On Resistance: 0.18 ohm

A low on-resistance reduces power loss and increases efficiency in switching applications, making this FET a cost-effective choice for high-performance designs.

Terminal Position: SINGLE

A single terminal position simplifies circuit designs and makes layout easier, particularly in compact applications.

Technical Specifications

Power Field Effect Transistors (FET) STB23NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB23NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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