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STB200N6F3

STMicroelectronics

STB200N6F3 by STMicroelectronics

STB200N6F3 from STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a max drain current of 120 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for high-performance power management in compact designs.

Median Price

$2.599

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.599

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292

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$2.599

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Distributors (In-Stock)

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Digiode

USA . 4,864 parts In-Stock

1+ parts

$5.282

100+ parts

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4,864

$5.282

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Vyrian

USA . 2,066 parts In-Stock

1+ parts

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2,066

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Anansix

USA . 2,050 parts In-Stock

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2,050

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 695 parts In-Stock

1+ parts

$1.188

100+ parts

-

1k+ parts

$1.069

10k+ parts

-

695

$1.188

-

$1.069

-

MKK Technologies

India . 1,199 parts In-Stock

1+ parts

$2.233

100+ parts

-

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1,199

$2.233

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DigiPath Technology Company

USA . 1,199 parts In-Stock

1+ parts

$2.233

100+ parts

-

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1,199

$2.233

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-

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Ampacity Inc.

Singapore . 292 parts In-Stock

1+ parts

$4.730

100+ parts

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292

$4.730

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Corphita

USA . 324 parts In-Stock

1+ parts

$5.004

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324

$5.004

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Component Stockers USA

USA . 253 parts In-Stock

1+ parts

$99.990

100+ parts

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253

$99.990

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Alle Elektronik GmbH

Germany . 3,425 parts In-Stock

1+ parts

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3,425

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Parana Technologies

USA . 1,987 parts In-Stock

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$1.420

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1,987

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$1.420

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 404 parts In-Stock

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404

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Overview

Unlock unparalleled performance with the STB200N6F3 from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This N-channel power FET is designed for high-efficiency switching applications, ensuring reliability and durability even in demanding environments. With its robust construction and advanced technology, it delivers superior thermal management and exceptional current handling. Elevate your projects with a component that epitomizes quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the FET reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher electron mobility, allowing for faster switching speeds and better thermal performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and functionality, making it suitable for applications where reverse bias may occur.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control high power loads.

Surface Mount: YES

The surface mount capability allows for easier integration into compact circuit designs, saving space on PCBs.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60V ensures robustness against voltage spikes, enhancing circuit reliability.

Package Shape: RECTANGULAR

Rectangular packaging facilitates better PCB layout and allows for efficient thermal management.

Terminal Form: GULL WING

Gull wing terminals provide a strong mechanical connection and are easier to solder, reducing assembly time.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate voltage requirements while providing better performance in ON state.

Maximum Pulsed Drain Current (IDM): 480 A

High pulsed drain current capability makes it suitable for applications requiring short bursts of high energy.

Avalanche Energy Rating (EAS): 918 mJ

A high avalanche energy rating ensures robustness against transient events, protecting the FET from damage during unexpected conditions.

Maximum Drain Current (Abs): 120 A

The ability to handle up to 120A makes this FET ideal for high-power applications, ensuring reliable performance.

No. of Terminals: 2

A two-terminal design simplifies connections and can minimize circuit complexity.

Maximum Power Dissipation (Abs): 330 W

High power dissipation capability ensures that the FET can handle demanding applications without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces PCB footprint, enabling more compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology typically results in lower power consumption and faster switching speeds, ideal for modern electronics.

Maximum Operating Temperature: 175 °C

Operating at a high temperature threshold ensures reliability in demanding environmental conditions.

Transistor Element Material: SILICON

Silicon as the material offers good stability and performance characteristics for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and helps prevent oxidation, ensuring reliable connections.

Maximum Drain Current (ID): 120 A

Allows for consistent performance under load, making this FET suitable for heavy-duty applications.

Maximum Drain-Source On Resistance: 0.0035 ohm

Low on-resistance minimizes power losses during operation, enhancing overall efficiency in power applications.

Terminal Position: SINGLE

Single terminal position simplifies design and layout considerations in PCB manufacturing.

Maximum Time At Peak Reflow Temperature: 30 s

A longer peak reflow time allows for better solder joint reliability during manufacturing processes.

Peak Reflow Temperature: 245 C

High peak reflow temperature tolerance supports compatibility with various soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) STB200N6F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

918 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB200N6F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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