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STB200N4F3

STMicroelectronics

STB200N4F3 by STMicroelectronics

STB200N4F3 from STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 120 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,490 parts In-Stock

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Digiode

USA . 1,045 parts In-Stock

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1,045

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Tectiva GmbH

Germany . 1,000 parts In-Stock

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Vyrian

USA . 292 parts In-Stock

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

1+ parts

$0.391

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$0.352

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2,068

$0.391

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$0.352

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MKK Technologies

India . 2,085 parts In-Stock

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$0.735

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$0.735

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DigiPath Technology Company

USA . 2,085 parts In-Stock

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$0.735

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2,085

$0.735

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AZTECH Wire

Italy . 306 parts In-Stock

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$20.410

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306

$20.410

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Alle Elektronik GmbH

Germany . 3,002 parts In-Stock

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Corphita

USA . 1,397 parts In-Stock

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Parana Technologies

USA . 1,350 parts In-Stock

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$0.468

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$0.468

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Kepictronics

USA . 1,000 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance with the STB200N4F3 by STMicroelectronics, a leading name in semiconductor innovation. This N-channel power FET delivers exceptional efficiency and reliability, making it ideal for demanding switching applications. With its compact design and robust features, it ensures seamless integration into your projects, enhancing overall system performance while reducing energy consumption. Elevate your designs with ST's trusted quality and experience unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures a lightweight design while providing effective protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance for higher current applications, making this product efficient for various power management tasks.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit reliability by protecting against voltage spikes, adding an extra layer of safety in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is ideal for use in power supplies and motor controls.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into automated manufacturing, enhancing production efficiency.

Minimum DS Breakdown Voltage: 40 V

With a breakdown voltage of 40V, this device can handle significant voltage levels, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space, providing flexible layout options for compact electronic designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide reliable electrical connections, which is advantageous in manufacturing.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a lower on-resistance and better control, making this FET efficient for switching applications.

Maximum Pulsed Drain Current (IDM): 480 A

The capability to handle pulsed currents up to 480 A offers unparalleled performance for high-demand applications.

Avalanche Energy Rating (EAS): 862 mJ

A high avalanche energy rating ensures that the FET can withstand transient voltage spikes, enhancing circuit reliability.

Maximum Drain Current (Abs) (ID): 120 A

The ability to accommodate a maximum drain current of 120 A allows for robust performance in demanding applications.

No. of Terminals: 2

A simple two-terminal design reduces complexity, making it easier to integrate into various circuits.

Maximum Power Dissipation (Abs): 300 W

A maximum power dissipation rating of 300 W allows for effective heat management and reliability in high-power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports space-saving designs, beneficial for portable and dense electronic applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enhances switching speed and efficiency, making it a reliable choice for modern electronic devices.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can perform in high-temperature environments, ensuring durability.

Transistor Element Material: SILICON

Silicon as a material ensures good thermal conductivity and reliability, making it a standard choice in power electronics.

Maximum Drain Current (ID): 120 A

This specification confirms its ability to provide reliable performance under substantial load conditions.

Maximum Drain-Source On Resistance: 0.004 ohm

The low on-resistance minimizes power loss during operation, enhancing the overall efficiency of the circuit.

Terminal Position: SINGLE

Having a single terminal position simplifies the circuit layout and can streamline the design process.

Case Connection: DRAIN

DRAIN case connection simplifies integration and ensures a clear flow of current within the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STB200N4F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

862 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.004 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB200N4F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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