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STA5620CTR

STMicroelectronics

STA5620CTR by STMicroelectronics

STA5620CTR by STMicroelectronics is a BICMOS technology TELECOM CIRCUIT IC with 2.7V supply voltage. It operates in industrial temperature range (-40 to 85 °C) and has a compact SQUARE package (5x5mm). Ideal for telecom interface applications due to its small form factor and high-temperature tolerance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,775 parts In-Stock

1+ parts

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7,775

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Anansix

USA . 1,825 parts In-Stock

1+ parts

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1,825

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Digiode

USA . 1,480 parts In-Stock

1+ parts

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1,480

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,272 parts In-Stock

1+ parts

$8.459

100+ parts

-

1k+ parts

$7.613

10k+ parts

-

1,272

$8.459

-

$7.613

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Modulus Dynamics

Lithuania . 10 parts In-Stock

1+ parts

$15.660

100+ parts

$15.660

1k+ parts

$15.660

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10

$15.660

$15.660

$15.660

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MKK Technologies

India . 1,305 parts In-Stock

1+ parts

$15.907

100+ parts

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1,305

$15.907

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DigiPath Technology Company

USA . 1,305 parts In-Stock

1+ parts

$15.907

100+ parts

-

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10k+ parts

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1,305

$15.907

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-

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AZTECH Wire

Italy . 1,150 parts In-Stock

1+ parts

$20.680

100+ parts

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1,150

$20.680

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Benley Electronics

USA . 2,099 parts In-Stock

1+ parts

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2,099

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A-Z Elektronik GmbH

Germany . 1,578 parts In-Stock

1+ parts

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1,578

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Corphita

USA . 897 parts In-Stock

1+ parts

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897

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Parana Technologies

USA . 131 parts In-Stock

1+ parts

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100+ parts

$10.114

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131

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$10.114

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Overview

Elevate your telecom interface solutions with the STA5620CTR by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge technology in a compact SQUARE package shape, perfect for industrial applications. With a wide operating temperature range and low power consumption, this TELECOM CIRCUIT IC offers unmatched performance and efficiency. Trust in STMicroelectronics to provide you with the value and advantages you need to stay ahead in the fast-paced world of telecommunications.

Feature Benefit Bullets

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration into tight spaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable operation.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows for versatility in different environments and applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring stable performance over time.

Maximum Seated Height: 1 mm

Low seated height allows for a compact design and easy integration into space-constrained devices.

Width: 5 mm

The compact width enables easy placement on a PCB and efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps in efficient manufacturing processes and reduces the risk of component damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and assembly of the product for reliable performance.

Length: 5 mm

Compact length allows for flexibility in board layout and integration in various designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in challenging industrial environments.

Technology: BICMOS

BICMOS technology offers a balance between performance and power efficiency, making this product suitable for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimal performance and compatibility in telecom systems.

Nominal Supply Voltage: 2.7 V

Low nominal supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting on a PCB, saving board space and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 classification indicates the product has moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Technical Specifications

Other Function Telecom Interface ICs STA5620CTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Shape:

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.7 V

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Pitch:

.5 mm

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

STA5620CTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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