Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA5630ATR by STMicroelectronics is a 32-terminal telecom IC with CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 1.8V, it is designed for telecom circuit applications in a square chip carrier package.
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Surface mount technology allows for easy and efficient placement and soldering of the IC on PCBs, saving time and effort during manufacturing.
The square package shape helps in optimal space utilization on the PCB, making it suitable for compact electronic devices.
The high number of terminals allows for multiple connections, enabling the IC to handle complex functions within telecom interfaces.
With a high maximum operating temperature, this IC can withstand demanding environmental conditions in industrial settings without compromising performance.
The compact width of the IC makes it suitable for use in space-constrained applications where size matters.
CMOS technology offers low power consumption and high noise immunity, making this IC efficient and reliable for telecom applications.
The low nominal supply voltage helps in reducing power consumption and heat dissipation, making the IC energy-efficient and cost-effective.
Other Function Telecom Interface ICs STA5630ATR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
STA5630ATR Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM2931AZ-5.0G
Onsemi
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Daco Semiconductor
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
1N4148
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS303C
Idec
ROTARY SWITCH;
Texas Instruments
ULN2803A by Texas Instruments is a peripheral driver with 8 functions. It has a max supply voltage of 3V and can operate in temperatures ranging from -40 to 85°C. This IC is commonly used as a buffer or inverter based peripheral driver for various applications.
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
BLUENRG-232
STMicroelectronics
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
LBCA2HNZYZ-711
Murata Manufacturing
Murata Manufacturing's LBCA2HNZYZ-711 is a telecom IC with 37 terminals, operating b/w -40°C to 85°C. It has a compact rectangular package measuring 7mm x 7.4mm and a low seated height of 1mm. Ideal for industrial applications requiring a nominal voltage of 2.5V and MSL level of 3.
ISP1507-AC-ST
Insight Sip
ISP1507-AC-ST by Insight Sip is a telecom IC with 3V supply voltage, 2 Mbps data rate, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring high-speed communication in compact form factor MICROELECTRONIC ASSEMBLY package.
NEO-M8T-0
U-blox Ag
NEO-M8T-0 by U-blox Ag is a telecom IC with 24 terminals, operating from -40 to 85°C. With a compact size of 12.2mm x 16mm and low supply voltage of 3V, it's ideal for industrial applications requiring precise positioning and timing accuracy. Its no-lead terminal form and dual position make it suitable for various telecom circuit designs.
HTRC11001T/02EE
NXP Semiconductors
NXP Semiconductors' HTRC11001T/02EE is a telecom interface IC with 14 terminals, operating at 5V. It features a small outline package style, industrial temperature grade, and nickel palladium gold terminal finish. Ideal for telecom circuits, this IC has a max seated height of 1.75mm and operates b/w -40 to 85°C.
ATWILC1000-MR110UB
Microchip Technology
ATWILC1000-MR110UB by Microchip Technology is a surface mount telecom interface IC with 1 function. It operates at temperatures ranging from -40 to 85 °C and has a data rate of 72.2 Mbps. This IC is commonly used in industrial applications requiring a nominal voltage of 3.3 V.
BM23SPKS1NB9-0B02AA
BM23SPKS1NB9-0B02AA by Microchip Technology is a Telecom IC with 43 terminals, operating at -20 to 70°C. It has a rectangular package style, measuring 15mm in width and 29mm in length. Ideal for telecom applications requiring a nominal voltage of 3.7V and terminal pitch of 1.2mm.
RN4020-V/RM
RN4020-V/RM by Microchip Technology is a telecom IC with 24 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and operates b/w -30°C to 85°C. Ideal for applications requiring surface mount technology in compact spaces.
BM70BLES1FC2-0B04AA
Microchip Technology's BM70BLES1FC2-0B04AA is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a data rate of 0.0086 Mbps and operates at 3V supply voltage. This rectangular package is ideal for industrial applications requiring low-power telecom circuit integration.
ISP1507-AX-RS
ISP1507-AX-RS by Insight Sip is a telecom IC with 62 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and runs on a 3V supply voltage. Ideal for industrial applications requiring high-speed communication in compact form factors.
CY7B933-JXC
Infineon Technologies
Infineon Technologies' CY7B933-JXC is a BICMOS technology telecom IC with 28 terminals in a square chip carrier package. Operating at 5V, it supports data rates up to 400 Mbps and draws a max supply current of 155mA. Ideal for telecom circuits, this IC has a temperature range of 0-70°C and is surface mountable.
MAX-8Q-0
MAX-8Q-0 by U-blox Ag is an AEC-Q100 graded telecom IC with 18 terminals, operating b/w -40 to 85°C. With a nominal voltage of 3V, it is ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package style. The IC's DUAL terminal position and NO LEAD form make it suitable for telecom circuit designs needing high reliability in harsh environments.
SX1276IMLTRT
Semtech
Semtech's SX1276IMLTRT is a 28-terminal IC with 3.3V supply, operating from -40 to 85°C. Telecom circuit type with 0.65mm pitch, ideal for industrial applications requiring low-profile square package and matte tin finish.
BMD-300-A-R-00
BMD-300-A-R-00 by U-blox Ag is a surface mount telecom IC with 47 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3V. With a data rate of 2 Mbps, it is ideal for applications requiring high-speed telecommunications functionality.
SIM7600G-H
Simcom Wireless Solutions
SIM7600G-H by Simcom Wireless Solutions is a telecom IC with 136 terminals, operating from -40 to 85°C. It supports data rates up to 150 Mbps and operates at a nominal voltage of 3.8V. Ideal for industrial applications requiring high-speed connectivity in a compact square package.
ST60-2230C-PU
Laird Technologies
TELECOM CIRCUIT;
453-00041C
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
ISO508P
Burr-Brown Corporation
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TM266DVA1
Inrcore
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.5;
ETRX357HR
Silicon Labs
ETRX357HR by Silicon Labs is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 1.27mm. Ideal for industrial applications requiring telecom circuit interfaces in compact MICROELECTRONIC ASSEMBLY package style.
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STA5620ATR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: VQCCN; Package Shape: SQUARE; Terminal Finish: Tin (Sn); Moisture Sensitivity Level (MSL): 3;
STA5620CTR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: VQCCN; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Maximum Time At Peak Reflow Temperature (s): 30;
STA5620TR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
STA5630A
STA5630TR
STA5635A
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
STA5635ATR
STA5635S
TELECOM CIRCUIT; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
STA5635STR
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