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STA5620ATR

STMicroelectronics

STA5620ATR by STMicroelectronics

STA5620ATR by STMicroelectronics is a BICMOS technology TELECOM CIRCUIT with 2.7V supply voltage. It operates b/w -40 to 85 °C, has a square package shape, and tin terminal finish. Ideal for industrial telecom interface applications due to its compact size and high temperature tolerance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,805 parts In-Stock

1+ parts

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4,805

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Digiode

USA . 2,087 parts In-Stock

1+ parts

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2,087

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Anansix

USA . 1,901 parts In-Stock

1+ parts

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1,901

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,420 parts In-Stock

1+ parts

$7.163

100+ parts

-

1k+ parts

$6.447

10k+ parts

-

1,420

$7.163

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$6.447

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MKK Technologies

India . 868 parts In-Stock

1+ parts

$13.470

100+ parts

-

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868

$13.470

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DigiPath Technology Company

USA . 868 parts In-Stock

1+ parts

$13.470

100+ parts

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868

$13.470

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Metaverse IC Inc.

Canada . 2,202 parts In-Stock

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2,202

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Corphita

USA . 841 parts In-Stock

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841

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Parana Technologies

USA . 184 parts In-Stock

1+ parts

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100+ parts

$8.565

1k+ parts

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184

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$8.565

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Overview

Unlock the full potential of your telecom applications with the STA5620ATR by STMicroelectronics. Trust in the reputation of a leading manufacturer to deliver top-quality telecom interface ICs that exceed expectations. This versatile product offers exceptional value, providing customers with reliable performance and seamless integration. Experience the benefits of advanced technology without compromising on durability or efficiency. Elevate your projects with the STA5620ATR and witness the difference it can make in your telecommunications systems.

Feature Benefit Bullets

Package Shape: SQUARE

The square package shape provides a compact form factor which can be useful for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial environments where temperature variations might occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can also operate in cold temperatures without any issues.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and electrical conductivity, ensuring reliable connections in the circuit.

Maximum Seated Height: 1 mm

The low seated height allows for the product to be used in slim devices or where space is limited.

Width: 5 mm

The narrow width allows for more components to be placed closely together on a PCB, optimizing space usage.

Peak Reflow Temperature: 260 C

The high peak reflow temperature ensures the product can withstand the soldering process during manufacturing without any damage.

Temperature Grade: INDUSTRIAL

Being an industrial-grade product means it is designed to operate reliably in harsh environmental conditions commonly found in industrial settings.

Nominal Supply Voltage: 2.7 V

The lower supply voltage requirement can lead to energy savings and better power efficiency in the overall system.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for more connections in a limited space, enabling high-density integration in the circuit design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has a moderate level of sensitivity to moisture, making it easier to handle during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs STA5620ATR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Shape:

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.7 V

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Pitch:

.5 mm

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

STA5620ATR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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