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STA5620TR

STMicroelectronics

STA5620TR by STMicroelectronics

STA5620TR by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85°C. It features a compact 5mm x 5mm square package with no lead terminals and supports a nominal voltage of 2.7V. Ideal for low-power telecom circuits, it ensures efficient performance with a max current of just 19µA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,043 parts In-Stock

1+ parts

-

100+ parts

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5,043

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Digiode

USA . 4,645 parts In-Stock

1+ parts

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1k+ parts

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4,645

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Anansix

USA . 238 parts In-Stock

1+ parts

-

100+ parts

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238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,882 parts In-Stock

1+ parts

$5.570

100+ parts

-

1k+ parts

$5.013

10k+ parts

-

1,882

$5.570

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$5.013

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MKK Technologies

India . 1,193 parts In-Stock

1+ parts

$10.473

100+ parts

-

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1,193

$10.473

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DigiPath Technology Company

USA . 1,193 parts In-Stock

1+ parts

$10.473

100+ parts

-

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10k+ parts

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1,193

$10.473

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AZTECH Wire

Italy . 676 parts In-Stock

1+ parts

$21.900

100+ parts

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676

$21.900

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Component Stockers USA

USA . 790 parts In-Stock

1+ parts

$99.990

100+ parts

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10k+ parts

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790

$99.990

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A-Z Elektronik GmbH

Germany . 5,972 parts In-Stock

1+ parts

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5,972

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 4,286 parts In-Stock

1+ parts

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4,286

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Parana Technologies

USA . 2,367 parts In-Stock

1+ parts

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100+ parts

$6.659

1k+ parts

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2,367

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$6.659

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Overview

Unlock unparalleled performance with the STA5620TR from STMicroelectronics—a trusted leader in innovative semiconductor solutions. This advanced telecom interface IC combines rugged reliability with a compact design, ideal for a range of applications in industrial environments. With its robust temperature range and energy-efficient operation, it empowers your projects to thrive, delivering exceptional value and enhancing overall system efficiency. Experience the difference with STMicroelectronics—where quality meets innovation!

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for easier integration into compact PCB layouts, making it ideal for modern electronics.

Package Shape: SQUARE

The square package shape contributes to uniformity in layout design and optimizes the use of space on the PCB.

Power Supplies (V): 2.7

With a low power supply requirement of 2.7 V, the device is energy-efficient, reducing power consumption in the application.

No. of Terminals: 32

The 32 terminals provide ample connectivity options to integrate with various components, enhancing versatility in designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability improve thermal management, making it suitable for high-density applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliable performance in a wide range of environments, including industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this product suitable for extreme environments and applications requiring high reliability.

Terminal Position: QUAD

The quad terminal position promotes easier routing and soldering, improving assembly efficiency.

Maximum Seated Height: 1 mm

The low seated height minimizes space consumption on the PCB, enabling better design for compact devices.

Width: 5 mm

At just 5 mm wide, this component is suitable for space-constrained applications, maximizing design flexibility.

Length: 5 mm

The 5 mm length supports easy placement on smaller boards, contributing to more compact product designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this IC is robust and reliable for demanding operational conditions.

Technology: BICMOS

BICMOS technology provides both low power consumption and high-speed performance, making it ideal for telecom applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the footprint on the PCB and enhances soldering reliability.

Maximum Supply Current: 0.019 mA

A maximum supply current of 0.019 mA indicates low power draw, which is beneficial for battery-operated devices.

Telecom IC Type: TELECOM CIRCUIT

This telecom circuit type ensures optimized performance in communication applications, catering to specific telecom needs.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7 V allows for compatibility with standard logic levels, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for increased density in footprints, making it suitable for advanced, compact designs.

Technical Specifications

Other Function Telecom Interface ICs STA5620TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.019 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

STA5620TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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